The structural stability and durability of a sensing device at high‐temperatures (HT) have important effects on its functionality and reliability. This becomes more critical in the devices that work based on the surface acoustic waves (SAW). In this study, the thermomechanical and creep behaviors of the metallization systems, RuAl, MoLa, and Mo suggested for the electrodes of HT‐SAW sensors are investigated. Several experiments are designed to obtain the state and the value of stress in the films deposited on a Si [100] substrate caused by the fabrication process and the operational conditions. Results show that after the film deposition, the intrinsic compressive stress in the MoLa film is significantly lower than the other films. However, after annealing the samples, the lowest residual stress is reached in the Mo. Linear stress variations during the thermal cycling of the annealed samples are obtained for all metallizations. To study the durability of the films at HT, the creep behavior of the samples is investigated by keeping them at a temperature of 600 °C for 10 h. The creep rate and its constitutive equation for the films are obtained. It is observed that the creep rate of MoLa and Mo films is much lower than RuAl.