“…Various surface passivation methods, especially passivation through PECVD SiN [3] have helped in mitigating the current collapse phenomenon. Secondly, the high gate leakage currents that the conventional GaN HEMTs with Schottky metal gates suffer from, that limits the gate voltage swing and thus affecting the maximum output power as well the microwave performance [4,5]. To reduce the gate leakage currents, researchers have tried various gate dielectrics such as SiO 2 [6,7], SiN [8,9], Al 2 O 3 [10], MgO [11], Sc 2 O 3 [12], and ZrO 2 [13].…”