2023
DOI: 10.1007/s10854-022-09496-9
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The effect of Ge on the microstructure, thermal behavior, and mechanical properties of lead-free Sn-5Sb-0.7Cu solder alloy

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Cited by 2 publications
(1 citation statement)
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“…The fabrication of lead-free solders by the vacuum melting process is now widely used to improve the wetting characteristics and mechanical properties of lead-free solders. The vacuum melting process is a type of casting method used to fabricate Sn lead-free solder alloys where materials are melted under the protection of vacuum or other gases (hydrogen, argon, etc) in vacuum melting, which allows for precise control of the alloy composition and ensures a high degree of purity [31,32]. There is not enough study focused especially on the tensile properties of Sn-Zn based solders under elevated temperatures and strain-rate conditions.…”
Section: Introductionmentioning
confidence: 99%
“…The fabrication of lead-free solders by the vacuum melting process is now widely used to improve the wetting characteristics and mechanical properties of lead-free solders. The vacuum melting process is a type of casting method used to fabricate Sn lead-free solder alloys where materials are melted under the protection of vacuum or other gases (hydrogen, argon, etc) in vacuum melting, which allows for precise control of the alloy composition and ensures a high degree of purity [31,32]. There is not enough study focused especially on the tensile properties of Sn-Zn based solders under elevated temperatures and strain-rate conditions.…”
Section: Introductionmentioning
confidence: 99%