The Effect of Increasing Sn Content on High-Temperature Mechanical Deformation of an Mg-3%Cu-1%Ca Alloy

Abstract

Chill casting of magnesium alloy samples with secondary alloying elements of Cu, Ca and Sn at % w.t. concentrations in the range 1-5, 0.1-5 and 0.1-3 respectively, gave rise to appreciably enhanced resistance to high-temperature creep, while maintaining good heat conductivity. The latter was considered to be driven by Cu and Mg-Cu intermetallics while it was clear that Sn mediated the high-temperature performance, mainly via networks of Mg 2 Sn and MgCaSn precipitates along the Mg matrix grain boundaries. It was postulated that Sn formed intermetallics by preferential substitution of Ca atoms and, thus, did not degrade the heat conductivity by retaining Cu. The % w.t. stoichiometry with the optimum combination of heat conductivity and resistance to high-temperature creep was found to be Mg-3Cu-1Ca-0.1Sn.

Foreign-Particle Reinforcement of a Zr-Cu-X BMG

“…Structure-properties relationships of functional materials [1][2][3][4][5][6][7][8][9][10] may be improved by a wide array of processing routes [1,[11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29]. The functional class of bulk metallic glasses (BMGs) in particular possess higher elasticity [30] and superior fracture strength compared to the crystalline phase [31] and have, thus, high potential as structural materials, albeit at the cost of brittle fracture behaviour [32].…”

Plasma-spray synthesis and characterization of ti-based nitride and oxide nanogranules

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