“…The insertion of a charge injection layer, namely buffer layer, at source‐drain electrode/semiconductor interface is another common method to improve contact performance. [ 74,112–114 ] Various materials have been used as buffer layers to date such as aryl‐functionalized graphene oxides (GOs), [ 45,90 ] molybdenum oxide (MoO 3 ), [ 42,74,112 ] vanadium oxide (VO x ), [ 113 ] tungsten oxide (WO 3 ) [ 115,117 ] and some inorganic salts. [119] Also organic compounds like TCNQ, [ 117 ] (deoxyribonucleic acid (DNA), [ 119,120 ] poly(methyl methacrylate) (PMMA), [ 121 ] subphthalocyanine chloride (SubPc), triphenyldiamine derivative (TPD), 4,40,400‐tris[3‐methylphenyl(phenyl)amino] triphenylamine (m‐MTDATA), [ 122 ] radical polymer poly(2,2,6,6‐tetramethylpiperidine‐1‐oxyl methacrylate) (PTMA) [ 123 ] etc.…”