The effect of model building on the accuracy of fatigue life predictions in electronic packages

Towashiraporn, P.; Subbarayan, Ganesh; McIlvanie, B.; Hunter, B.; Love, Dave; Sullivan, Bob

doi:10.1016/j.microrel.2003.08.012

Cited by 20 publications

(10 citation statements)

References 11 publications

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“…Area array components have evolved as a viable solution to meet the requirements of these devices. As packaging density is increasing, solder joint reliability has become a critical issue in the electronic packaging industry [1,2]. A large body of research has recently been conducted in relation to the reliability issues and properties of fine solder joints [3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Mechanical strength test method for solder ball joint in BGA package

Kim

Jung

2005

Met. Mater. Int.

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Ball shear tests were investigated in terms of effects of test parameters, i.e. shear height and shear speed, with an experimental and non-linear finite element analysis in order to evaluate the solder joint integrity of area array packages. The substrate was a common SMD type with solder bond pad openings of 460 Pm in diameter. Microstructural investigations were carried out using SEM, and the IMCs were identified with EDS. It was observed that increasing shear height, at fixed shear speed, results in decreasing shear force, while the shear force increased with increasing shear speed at fixed shear height. Excessive shear height could cause some detrimental effects on the test results such as unexpected high standard deviation values or shear tip sliding from the solder ball surface. Low shear height conditions are favorable for screening the type of brittle interfacial fractures or degraded layers in the interfaces.

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Section: Introductionmentioning

confidence: 99%

Mechanical strength test method for solder ball joint in BGA package

Kim

Jung

2005

Met. Mater. Int.

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“…In the present study, we used the refined finite element models of Towashiraporn et al (2004b) to analyze fracture propagation and life prediction using the earlier described hybrid model. Since the power cycling test condition involves complex, transient, anisothermal condition, transient heat transfer analysis using temperature-dependent convective heat transfer coefficients was carried out.…”

Section: Finite Element Analysis Of Accelerated Cycling Testsmentioning

confidence: 99%

“…The resulting nodal temperature solutions were then exported in temporal and spatial domains to the subsequent elastic-plastic-creep analysis. The details of the empirical life modeling including an extensive study of sources and effects of error in finite element analysis and the values of material properties are described by Towashiraporn et al (2004b).…”

Section: Finite Element Analysis Of Accelerated Cycling Testsmentioning

confidence: 99%

A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces

Towashiraporn

Subbarayan

Desai

2005

International Journal of Solids and Structures

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“…With the power of the computer capacity increasing, it is now possible to integrate more accurate definitions in finite element model such as material characterization, refined mesh and effects on the surrounding to evaluate the reliability [1]. This can also be said of power semiconductor modules where their reliability becomes a main focus on current research.…”

Section: Introductionmentioning

confidence: 99%