The Effect of Oxygen Partial Pressure on Heat Transfer and Solidification

Yu, Yan; Cramb, A. W.; Heard, Robert; Yuan, Fang; Cui, Jian

doi:10.2355/isijinternational.46.1427

Cited by 9 publications

(2 citation statements)

References 3 publications

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“…The droplet ejection apparatus was used by Wang [23] to study the effect of cermet coatings on the interfacial heat transfer behavior under sub-rapid solidification process, demonstrating that the Ni60 coating showed a better heat transfer capability due to a low porosity and good adhesion property. Yu [24] also applied this apparatus to investigate the effect of oxygen partial pressure on the solidification and interfacial heat transfer, founding that the oxygen pressure of the gas affected solidification process and undercooling. The interfacial heat transfer between the melt and roller is one of the most important issues during the initial solidification of molten steel in strip caster, which has a great effect on the surface and internal quality of the steel strips.…”

Section: Introductionmentioning

confidence: 99%

Formation of Deposited Oxide Film during the Sub-rapid Solidification of Silicon Steel Droplet and Its Effect on Interfacial Heat Transfer Behavior

Wang

Cai

et al. 2021

Metall Mater Trans B

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The droplet solidification technique was used to investigate the formation of deposited film and the interfacial heat transfer for the sub-rapid solidification of silicon steels. The composition of deposited films consists of MnO, FeO and SiO 2 for both the low and high-silicon steels. The deposited film could improve the wetting condition between the steel droplet and substrate. And the wetting condition between the droplet and substrate improves with the increasing of ejection times from 1 to 9, and thus the final contact angles decrease gradually from 105.1 to 72.8 deg. The peak value of heat flux increases with the number of solidification tests, indicating that the heat transfer condition between the droplet and substrate improves with the deposition of film. The peak value of heat flux increases from 5.64 to 7.42 MW/m 2 for low-silicon steel after the 9th ejection, and it is from 6.03 to 9.06 MW/m 2 for high-silicon steel. This is because the interfacial thermal resistance between the droplet and substrate reduces gradually with the increasing of test times. A higher Mn content in the high-silicon steel leads to a higher deposited rate of the oxide film than the low-silicon steel. Compared with the low-silicon steel, the increment of MnO content in the film for the high-silicon steel is 6.60 wt pct, and there is no obvious increment of SiO 2 in the film, though the increment of Si in high-silicon steel is 6.06 wt pct, and for Mn is only 0.72 wt pct.

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Section: Introductionmentioning

confidence: 99%

Formation of Deposited Oxide Film during the Sub-rapid Solidification of Silicon Steel Droplet and Its Effect on Interfacial Heat Transfer Behavior

Wang

Cai

et al. 2021

Metall Mater Trans B

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“…In these experiments, the droplet solidification method was used most widely [4][5][6][7][8] . In a typical experimental process, a melt droplet was molten and dripped onto a metal substrate surface, and then solidified to an ingot.…”

mentioning

confidence: 99%

Determination of interfacial heat flux of stainless steel solidification on copper substrate during the first 0.2 s

Zhang

Yuan

et al. 2011

J. Shanghai Jiaotong Univ. (Sci.)

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Interfacial heat transfer is a key issue in many solidification processes. In the paper, a novel experimental apparatus has been designed and on this basis, the instantaneous interfacial heat transfer between molten steel or solidified shell and copper substrate during the first 0.2 s has been studied. The investigated parameters include melt superheat, substrate temperature and surface roughness. The results show that the peak value of the interfacial heat flux in the first stage of liquid/solid contact increases with melt superheat and changes slightly with substrate temperature and surface roughness. The interfacial heat flux in the stage of solid/solid contact has a similar trend of slow decrease in most conditions.It is self-evident that the interfacial heat transfer between molten metal and molds in the solidification processes is very important to casting. Most of the previous work [1][2][3] concentrated on the determination of interfacial heat transfer between casting and metal or sand molds in quite a long time, for example, from seconds to minutes. However, in many rapid or near rapid solidification processes, such as strip casting, the total solidification time is less than 0.5 s. Recently, studies on the interfacial heat transfer of initial solidification in fragments of second have been paid more attentions, but the materials most used in experiments are low melting point metals and alloys, such as aluminum alloy. For the high melting point alloys with high commercial value such as steel, studies on instantaneous interfacial heat transfer in solidification have not been intensively carried out.The solidification process of melt on metal substrate surface can be divided into two stages: liquid/solid contact and solid/solid (S/S) contact. In the first contact stage, a low interfacial thermal resistance and a high interfacial heat flux occur due to the better wettability condition between liquid and solid. In the S/S contact stage, the thermal resistance increases and the heat flux decreases owing to air gaps formed between the solidified shell and the substrate.Accurate determination of instantaneous interfacial heat transfer can not only expand our understanding on initial solidification, but also provide boundary conditions for numerical simulation. However, there are many difficulties in this problem. The high melt temperature results in no proper thermocouples which can be placed in the melt; the short solidification time requires quick response time of the temperature measurement parts; the high value and the great change of the heat flux result in a great temperature change in the substrate. It requires proper design of the substrate and the temperature measurement to insure good resolving power for the initial interfacial heat transfer.Various apparatuses and simulators have been developed to study this problem. In these experiments, the droplet solidification method was used most widely [4][5][6][7][8] . In a typical experimental process, a melt droplet was molten and dripped onto a metal subst...

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Sub-rapid Solidification Study by Using Droplet Solidification Technique

Wang

Zhu

2019

The Minerals, Metals &Amp; Materials Series

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The Effect of Oxygen Partial Pressure on Heat Transfer and Solidification

Cited by 9 publications

References 3 publications

Formation of Deposited Oxide Film during the Sub-rapid Solidification of Silicon Steel Droplet and Its Effect on Interfacial Heat Transfer Behavior

Formation of Deposited Oxide Film during the Sub-rapid Solidification of Silicon Steel Droplet and Its Effect on Interfacial Heat Transfer Behavior

Determination of interfacial heat flux of stainless steel solidification on copper substrate during the first 0.2 s

Sub-rapid Solidification Study by Using Droplet Solidification Technique

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