The Effect of Polyepoxyphenylsilsesquioxane and Diethyl Bis(2-hydroxyethyl)aminomethylphosphonate on the Thermal Stability of Epoxy Resin

Abstract

Polyepoxyphenylsilsesquioxane (PEPSQ) and diethyl bis(2-hydroxyethyl) aminomethylphosphonate (DBAMP) can improve the flame retardancy of epoxy resin (EP). In this paper, the results of the limiting oxygen index (LOI) and UL94 tests exhibited that PEPSQ and DBAMP had good synergistic flame retardancy. The non-isothermal degradation kinetics of EP containing PEPSQ and DBAMP was investigated by the Kissinger and Flynn−Wall−Ozawa methods. The results of the Kissinger method displayed that the addition of two flame retardants, PEPSQ and DBAMP, can slightly enhance the activation energy of EP, indicating that the additives delayed the thermal degradation of EP. The Flynn−Wall−Ozawa method further confirmed that the activation energy of EP during the whole thermal degradation process can be significantly increased by addition of the two flame retardants PEPSQ and DBAMP. When the degree of conversion exceeded 80%, the increase was more significant. This illustrated that the flame retardants finally achieved the purpose of improving the flame retardancy of EP by stabilizing the char layer.

Influence of Thiol-Functionalized Polysilsesquioxane/Phosphorus Flame-Retardant Blends on the Flammability and Thermal, Mechanical, and Volatile Organic Compound (VOC) Emission Properties of Epoxy Resins

“…Scanning electron microscopy (SEM) analysis was used to investigate the connection between the microstructure and flame retardancy of the EP system’s char layer after combustion [ 68 , 69 ]. The findings are presented in Figure 8 a–d.…”

Role of Copper Nanoparticles in the Thermal and Mechanical Properties of Expanded Graphite-Reinforced Epoxy Hybrids

“…Epoxy resins are a high-performance thermosetting polymer and have a unique combination of characteristics, which include low shrinkage, high dimensional and thermal stability, excellent electrical insulation, high mechanical properties, high chemical resistance, and easy processing. − Diglycidyl ether of bisphenol A (DGEBA) epoxy resin is created when epichlorohydrin and bisphenol A react with a basic catalyst. DGEBA contains benzene, methyl, and hydroxyl groups in the main molecular chain, which exhibits excellent comprehensive properties. , Consequently, epoxy resin is extensively applied in the electronics and electrical fields.…”