The effect of pulsed reverse current on the polarization behaviour of acid copper plating solutions containing organic additives

Pearson, T.; Dennis, J.K.

doi:10.1007/bf01033595

Cited by 47 publications

(40 citation statements)

References 4 publications

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“…In the absence of additives, the current density increases to a well-defined mass transfer limiting plateau slightly below 6 A dm )2 . The presence of HCl alone causes depolarization toward more positive potential relative to that obtained in an additive-free solution, similar to that reported previously [38][39][40]. This has been attributed to Cu 2+ being able to form a bridge with Cl ) at the electrode surface with shorter distance than that between Cu 2+ and H 2 O in a chloride-free solution [40].…”

Section: Polarization Curvessupporting

confidence: 72%

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

Tantavichet

Pritzker

2005

J Appl Electrochem

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DC and pulse plating of copper in acidic sulphate solutions containing benzotriazole (BTA) has been studied. When BTA is the only additive present, it generally has a stronger effect than the plating mode and significantly enhances deposit morphology and surface brightness over that produced in additive-free solutions. XPS and voltammetry analyses indicate that BTA is present at the surface of the deposit, but not through the entire coating, and does not become depleted within the solution over the course of plating. This may help explain why the initial surface smoothness and brightness is maintained as the coating grows beyond 5 lm thick. Plating mode does have a strong effect on deposit morphology under specific conditions. Pulse current plating at low frequency (50 Hz) and low duty cycle (20%) produces deposits with poorer quality than that obtained by DC plating. Pulse reverse plating yields very coarse and dull coatings when the frequency is low enough for metal dissolution to occur during the reverse time. Regardless of the plating mode, the addition of Cl ) eliminates most of the beneficial effects of BTA and leads to very rough and dull deposits. The observed effects are discussed in light of previous research on the electrodeposition and corrosion of the Cu-BTA and Cu-BTA-Cl systems.

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Section: Polarization Curvessupporting

confidence: 72%

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

Tantavichet

Pritzker

2005

J Appl Electrochem

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“…Copper was deposited from an electrolyte containing 0?05 mol dm 23 4 . This arrangement provided a low liquid junction potential and minimised further chloride contamination of the working electrode compartment due to leakage of the reference electrode filling solution.…”

Section: Methodsmentioning

confidence: 99%

“…The presence of Cu(I) species during copper deposition progressively became more important as chloride addition to the sulphate electrolyte was increased. 23 NaCl at 296 K were investigated. Linear sweep voltammetry was used to study the influence of chloride ion on the voltammetry of copper deposition using a platinum rotating disc electrode.…”

Section: E~ementioning

confidence: 99%

“…50-200 ppm, is generally used for copper electroplating 17 and 1 to 2610 23 mol dm 23 used in the electronics and electrical industries. 18 A higher chloride ion concentration (0?1-3?0 mol dm 23 ) is used in copper electrowinning; levels up to 9?0 mol dm 23 are used for copper refining in hydrothermal systems 19 and 280 g dm 23 used in the leaching of copper from copper mineral chalcopyrite. 20 In most cases, chloride ion is added as a supplement to other additives to achieve combinatorial effects.…”

Section: Introductionmentioning

confidence: 99%

“…20 In the presence of both Cl 2 and polyethylene glycol (PEG), however, the copper reduction may be inhibited to a more negative potential and the Cl 2 ion may assist in the formation of spherical PEG molecules and monolayer adsorption of PEG. 8,9,13,[22][23][24] The present work considers relatively dilute ,50 mmol dm 23 copper solutions which are found in rinse waters and environmental wastes. The effect of chloride ion on copper deposition in mixed chloridesulphate electrolytes at a constant pH of 2 is investigated using a rotating disc electrode.…”

Section: Introductionmentioning

confidence: 99%

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Electrodeposition of copper from mixed sulphate–chloride acidic electrolytes at a rotating disc electrode

Low

León

Walsh

2014

Transactions of the IMF

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The effect of chloride ion on the deposition of copper from low metal concentrations in aqueous, acid sulphate solutions was investigated. . Linear sweep voltammetry was carried out under well defined flow conditions at a smooth platinum rotating disc electrode. The progressive transition from a single, two-electron reaction for the reduction of Cu(II)RCu(0) to two, single-electron reactions for the reduction sequence: Cu(II)RCu(I)RCu(0) was clearly evident as the chloride ion concentration increased. The charge transfer and mass transport characteristics of these reactions were evaluated. The formal potential for the Cu(II) reduction to Cu(I), the shift in the potential region for complete mass transport controlled reduction of Cu(I) to Cu(0) and the potential for hydrogen evolution at the deposited copper were also studied. A semi-logarithmic relationship between exchange current density and half-wave potential for Cu(II)RCu(I) with chloride ion was achieved when the Cl 2 /Cu(II) ratio in the electrolytes exceeded 2, due to the presence of the Cu(I) dichlorocuprous anion, CuCl { 2 .

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The Initial Stages of Copper Deposition on Bare and Chemically Modified Gold Electrodes

Schneeweiss

Kolb²

1999

phys. stat. sol. (a)

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The effect of pulsed reverse current on the polarization behaviour of acid copper plating solutions containing organic additives

Cited by 47 publications

References 4 publications

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

Electrodeposition of copper from mixed sulphate–chloride acidic electrolytes at a rotating disc electrode

The Initial Stages of Copper Deposition on Bare and Chemically Modified Gold Electrodes

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