The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Pan, Jianbiao; Toleno, Brian J.; Chou, Tzu‐Chien; Dee, Wesley J.

doi:10.1108/09540910610717901

Cited by 54 publications

(27 citation statements)

References 6 publications

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“…The effect of reflow profile on the solder joint shear strength was reported by Pan et al (2006). The effect of thermal shock on the solder joint shear strength has also been presented (Webster et al, 2007).…”

Section: Introductionmentioning

confidence: 96%

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

Pan

Chou

Bath³

et al. 2009

Soldering &Amp; Surface Mount Technology

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Purpose -The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints. Design/methodology/approach -A four-factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 328C above solder liquidus temperatures (or 230, 240 and 2508C for SAC305 and 195, 205, and 2158C for SnPb). The TAL has two levels, 30 and 90 s. The thermally shocked test vehicles are subjected to air-to-air thermal shock conditioning from 2 40 to 1258C with 30 min dwell times (or 1 h/ cycle) for 500 cycles. Samples both from the initial time zero and after thermal shock are cross-sectioned. The IMC thickness is measured using scanning electron microscopy. Statistical analyses are conducted to compare the difference in IMC thickness growth between SAC305 solder joints and SnPb solder joints, and the difference in IMC thickness growth between after thermal shock and after thermal aging. Findings -The IMC thickness increases with higher reflow peak temperature and longer time above liquidus. The IMC layer of SAC305 soldered joints is statistically significantly thicker than that of SnPb soldered joints when reflowed at comparable peak temperatures above liquidus and the same time above liquidus. Thermal conditioning leads to a smoother and thicker IMC layer. Thermal shock contributes to IMC growth merely through hightemperature conditioning. The IMC thickness increases in SAC305 soldered joints after thermal shock or thermal aging are generally in agreement with prediction models such as that proposed by Hwang. Research limitations/implications -It is still unknown which thickness of IMC layer could result in damage to the solder. Practical implications -The IMC thickness of all samples is below 3 mm for both SnPb and SAC305 solder joints reflowed at the peak temperature ranging from 12 to 328C above liquidus temperature and at times above liquidus ranging from 30 to 90 s. The IMC thickness is below 4 mm after subjecting to air-to-air thermal shock from 2 40 to 1258C with 30 min dwell time for 500 cycles or thermal aging at 1258C for 250 h. Originality/value -The paper reports experimental results of IMC thickness at different thermal conditions. The application is useful for understanding the thickness growth of the IMC layer at various thermal conditions.

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Section: Introductionmentioning

confidence: 96%

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

Pan

Chou

Bath³

et al. 2009

Soldering &Amp; Surface Mount Technology

Self Cite

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“…Previous researches were done as reported by Guo F.J in Composite lead-free electronic solders, nanoparticle additions to solder materials have been demonstrated to result in increased reliability of solder joints. [3] Hardening the solder with the addition of nanoparticles and stabilizing the grain structure should result in increased reliability. The reinforcement particles should not be prone to significant coarsening during reflow and service.…”

Section: Introductionmentioning

confidence: 99%

The fabrication of composite solder by addition of copper nano powder into Sn-3.5Ag solder

Nadia

2009

2009 International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Copper nano powder was incorporated into Sn-3.5Ag solder at 3wt%, by mechanically alloyed (MA) by ball milling in a planetary ball mill at room temperature. The rotation speed was kept constant at 150 rpm with different milling time, 26 hours, 78 hours and 120 hours. The milled solder was mixed with flux and reflowed at 240°C for 60 seconds. XRD result confirmed the formation of Cu 3 Sn after 120 hours of milling time. The melting temperature of the samples decreased as a function of milling time. The wetting angle was improved by 48% for the composite solder Sn-3.5Ag-nano-3.0Cu for 120 hours ball milled, compared to the Sn3.5Ag solder. Increased of hardness was obtained as a result of incorporation of nanoparticle.

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“…One of the main differences between SnPb and SnAgCu welds without lead is that SnAgCu weld demands higher Reflow temperature than SnPb welds, the fusion point is 217 °C -219 °C, superior to the SnPb weld temperature, that has a fusion point of 183 °C [18]. It is also necessary to verify the adaptation of the assembly components.…”

Section: Implementation Of Lead-free Weldingmentioning

confidence: 99%

Analysis of the quality of the welding process in the exchange of component of BGA technology

Marques-Costa

Silva-Vieira

Pereira-Lopes

et al. 2015

Rev. Fac. Ing. Antioquia

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The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Cited by 54 publications

References 6 publications

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

The fabrication of composite solder by addition of copper nano powder into Sn-3.5Ag solder

Analysis of the quality of the welding process in the exchange of component of BGA technology

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