The Effect of Superimposed A.C. on D.C. in Electrodeposition of Ni-Fe Alloys

Kovac, Z.

doi:10.1149/1.2407950

Cited by 33 publications

(9 citation statements)

References 11 publications

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“…Formation of Zn hydroxide film during the electrodeposition of the alloys.--There is, as yet, no theoretical explanation which satisfactorily describes the mechanism of the anomalous codeposition. Many hypothesis have been proposed so far (11)(12)(13) and one of the most plausible mechanisms included the assumption that the pH in the vicinity of the cathode was raised to permit the precipitation of metal hydroxide on the cathode (14)(15)(16).…”

Section: Resultsmentioning

confidence: 99%

Mechanism of the Electrodeposition of Zinc Alloys Containing a Small Amount of Cobalt

Higashi

Fukushima

Urakawa

et al. 1981

J. Electrochem. Soc.

163

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Corrosion resistant Zn‐Co alloys were electrodeposited on the steel sheet cathode from an acid galvanizing bath containing a small amount of cobalt sulfate. Under most of the plating conditions studied, the anomalous codeposition and, hence, the preferential deposition of electrochemically less noble Zn occurred. The electrodeposition process of the alloy including the Zn hydroxide formation resulting from the rise in pH in the vicinity of the cathode was estimated by electrochemical and spectroscopic studies.

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Section: Resultsmentioning

confidence: 99%

Mechanism of the Electrodeposition of Zinc Alloys Containing a Small Amount of Cobalt

Higashi

Fukushima

Urakawa

et al. 1981

J. Electrochem. Soc.

163

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“…However, others have found that the first roughly 1200-1500A of plate is very iron rich, usually 40-60% instead of 20% Fe (4,5). If these gradients do in fact exist in our wires (6), we feel that they could be eliminated by changes in the NiFe solution flow pattern around the wire and/or by the superposition of an a-c current on the d-c NiFe plating current (7).…”

Section: Resultsmentioning

confidence: 99%

pH Optimization Studies on a Basic Ammoniacal Citrate Ni-Fe Plating Solution for Use in Plated Wire Memory Production

Barauskas

Guttensohn

1973

J. Electrochem. Soc.

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Plated wire was produced from a basic ammoniacal citrate Ni-Fe plating solution. The solution pH and solution aging characteristics were investigated vs. plated wire material, device, and memory properties. An optimum operating range of this solution was found to be between pH = 8.4 and 8.6. A group of equations was developed which accurately predicted both the device and the memory characteristics of the plated wire from only the materials data and solution pH.The electrodeposition of zero magnetostrictive Ni-Fe alloys for plated wire memory applications has been successfully accomplished with either acid or basic Ni-Fe electrolyte solutions (1, 2). Both solution types were also tried in our laboratories. A preference was found after extensive experimentation with both. The basic ammoniacal citrate solution was found more acceptable for the following reasons: (i) The evaporation rate of deionized water from the Ni-Fe baths was lower for the basic bath which was operated between 18~176 than for the acid sulfate baths which were operated between 45~176The advantage of the lower evaporation rate is that the concentration level of the various ionic species present in the bath is more stable with time. (ii) After a two-day "age in" the oxidation of Fe + + to Fe + + + in the basic solution is complete. In the case of the acid sulfate solutions, the oxidation aging is a continuing process which necessitates daily bath analysis and appropriate additions.After two days only pH adjustments have to be made to the basic solution. This is accomplished by additions of NH4OH. The Ni and Fe levels in the basic solution are monitored every two weeks and maintained by additions of nickel and iron (III) citrate. By using this technique we were able to maintain a bath for two and one-half years. (iii) No stress relievers were necessary. (iv) Bath analysis and maintenance are simpler which result in lower costs for bath upkeep.In the process of working with the basic bath as described in Stephen's patent (2), it was found that concentration changes and Ni-Fe ratio changes were required in order to produce zero magnetostrictive films with our plating line (3). The 5 to 1 Ni-Fe ratio which Stephen proposes had to be changed to 9 to 1 because of our solution flow rates and cell currents. Also the suggested pH range of 9.2-9.25 at our operating conditions and the new concentration levels produced some undesirable plated wire device and memory properties. Therefore, it became of interest to characterize fully, for the conditions of use, the basic ammoniacal citrate Ni-Fe plating solution in terms of the material, device, and memory properties of the plated wire. The characterization led to a new and more stable pH operating range and the development of a group of equations which allowed us to predict the device and memory properties of the annealed plated wire from only the materials and pH data. Results from these equations were spot checked with an off-line memory tester. Agreement was close enough to allow us to eliminate an on-line m...

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“…The electrolytic dendritic growth Use of alternating current in deposition technolof cadmium was studied by Wranglen [101, who ogy is a familiar method of improving deposit characfound it to grow as single crystals by a sequential teristics [11. Deposit characteristics like grain size, layer growth mechanism involving two-dimensional brightness, hardness etc., are shown to be influenced nucleation for each layer. Price [11], in a study on favourably by superimposing ac during deposition vapour-grown cadmium dendrites, reported that the [2][3][4]. Morphological studies have been made in our growth occurs at re-entrancies produced by twinning.…”

Section: Introductionmentioning

confidence: 92%

Electrocrystallization of cadmium on copper single crystal planes under the influence of an asymmetric alternating current

Ahmed

Pushpanaden

1977

Journal of Crystal Growth

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Cadmium grows with a {000i} preferred orientation when electrodeposited on copper single crystals with pure dc. Superimposed alternating current in suitable ratios with dc perfects the {oooi} orientation in cadmium deposits. The snowflake dendritic growth produced in cadmium deposits under the influence of superimposed ac of a higher magnitude appears to initiate at the corners of hexagonalL platelets. This is probably due to the re-entrancies created by rotation induced twinning of the hexagonal platelets.

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The Effect of Superimposed A.C. on D.C. in Electrodeposition of Ni-Fe Alloys

Cited by 33 publications

References 11 publications

Mechanism of the Electrodeposition of Zinc Alloys Containing a Small Amount of Cobalt

Mechanism of the Electrodeposition of Zinc Alloys Containing a Small Amount of Cobalt

pH Optimization Studies on a Basic Ammoniacal Citrate Ni-Fe Plating Solution for Use in Plated Wire Memory Production

Electrocrystallization of cadmium on copper single crystal planes under the influence of an asymmetric alternating current

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