“…Magnetron sputtering and photolithography are commonly employed processes for fabricating blast foil transducer elements [8][9][10]. During the fabrication of metal bridge foils, various defects of different shapes and depths such as blind holes, through-holes, and scratches can arise on the surface of the exploded foil transducer element due to factors such as holes, pits, burrs, foreign particulate matter, and target droplets on the substrate surface [11][12][13][14][15]. Eliminating film defects entirely is challenging [16], and even when films are deposited using HiPIMS, an advanced physical deposition method, a significant number of defects can still occur [17].…”