The effect of surfactant on the structure, composition and magnetic properties of electrodeposited CoNiFe /Cu microwire

Electronucleation mechanism of copper in wastewater by controlled electrodeposition analysis

“…Especially anionic surfactants, which are composed of charged hydrophilic parts, can statically attract the positively charged copper ions, thereby interfering with the electrolytic recovery of copper. [11][12][13] In addition, if the non-ionic surfactants in the wastewater coexist with anionic surfactants, they attract each other through their hydrophobic tails. A mixture of anionic and non-ionic surfactants affects nucleation and crystal growth in copper electrocrystallization, which largely determines the physical and chemical properties of copper ion electrodeposition.…”