The current research on boiling in heat transfer applications has been
increased due to the effective heat dissipation ratein solar applications,
cooling of new generation electronic chips with the goal of improving
performance by controlling physical factors.Thermosyphons are one among the
phase change medium which has the higher critical heat flux to accelerate
the heat transfer. Current work in Thermosyphonfocuses on the design,
fabrication and performance analysis of dimpled Thermosyphonwith certain
variables like surface area of heat exchange, composition of working fluid
and setup angle. Due to the impact of nanotechnology, the investigation is
carried out by using Al2O3Nano fluid as working fluid. The experiments
are conducted initially with plain Thermosyphons, later with surface
modifications (dimple) by changing the orientation of the Thermosyphons.The
performance results of the plain Thermosyphon filled with water, plain
Thermosyphon filled with Nano fluid is compared with dimpled Thermosyphon
with Nano fluid at different angles such as 0?, 45?and 90?.Evaporator side
dimple and condenser side dimple also designed and investigated. It is
observed that thermal resistance for dimple Thermosyphon-Nano fluid is very
low in the range of 0.060C/W-0.200C/W when compared with Plain
Thermosyphon-water varies from 0.10C/W- 0.450C/W, for Plain
Thermosyphon-Nano fluid is 0.10C/W-0.310C/W. It is also observed that the
efficiency of dimpled tube Thermosyphon with Nano fluid is estimated as
50.66%, 69.7% and 74.23% at 0?, 45? and 90? respectively which is the
maximum value when compared with plain Thermosyphon with water and
Nanofluid.