1994
DOI: 10.1557/proc-338-295
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The Effect of Variability Among Grain Boundary Energies on Grain Growth in Thin Film Strips

Abstract: Grain growth in thin-film strips is important to interconnect reliability because grain boundary structures strongly effect the rate and mechanism of electromigration-induced failure. Previous simulations of this process have indicated that the transformation to the fully bamboo structure proceeds at a rate which decreases exponentially with time, and which is inversely proportional to the square of the strip width. We have also reported that grain boundary pinning due to surface grooving implies that there ex… Show more

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Cited by 10 publications
(6 citation statements)
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“…Low angle boundaries have long been known to be in a more stable, low-energy configuration. 22,33 As the structure evolves and seeks the lowest energy configuration, these low angle boundaries are more favorable in the absence of competing effects. Constraints on the system of interface area and neighboring lattice orientation are decreased with decreasing linewidths.…”
Section: Discussionmentioning
confidence: 99%
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“…Low angle boundaries have long been known to be in a more stable, low-energy configuration. 22,33 As the structure evolves and seeks the lowest energy configuration, these low angle boundaries are more favorable in the absence of competing effects. Constraints on the system of interface area and neighboring lattice orientation are decreased with decreasing linewidths.…”
Section: Discussionmentioning
confidence: 99%
“…Simulations of grain growth with variable boundary energies indicate that preferred boundary structures may develop in interconnect lines. 40 One investigation suggests the existence of a preferred in-plane orientation in very narrow Au lines. 41 In this case, the sidewall orientations were preferentially ͑110͒ instead of ͑112͒, as suggested by the data presented in this report.…”
Section: Discussionmentioning
confidence: 99%
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“…There are stable higher order junctions in the structures and the average number of edges is lower than 6. Mobility anisotropy alone does not affect the growth exponent n. Frost et al [37] report the evolution towards a steady-state regime with n = 1 and a constant grain boundary character distribution for thin films with columnar grains and random grain orientations in the plane of the film.…”
Section: Introductionmentioning
confidence: 99%
“…It is known that low angle boundaries ͑Ͻ10°͒ are characterized by low interfacial energy and slow diffusion paths compared to random grain boundaries. [15][16][17][18] At first glance, TEOS passivated lines show a larger fraction of low angle grain boundaries which implies better electromigration resistance. However, there is a special type of grain boundary called the CSL boundary 19 which can be found and has special characteristics.…”
Section: Microstructural Analysis Of Al"cu… Linesmentioning
confidence: 99%