“…To date, the most affective cooling systems are the systems based on impact jets and sprays, two-phase flows in minichannels and fluid flows in microchannels. These systems enable removal of heat fluxes of up to 500 W from the chip size 10 to 10 mm [1,2,3,4]. However, already now the electronic industry is ready to produce components where the heat flux density can reach values of 1 kW/cm 2 and higher [6].…”