The effects of dense carbon dioxide on nickel plating using emulsion of carbon dioxide in electroplating solution

Yan, Hao; Sone, Masato; Sato, Nobuyoshi; Ichihara, Shoji; Miyata, Seizo

doi:10.1016/j.surfcoat.2003.07.006

Cited by 40 publications

(24 citation statements)

References 13 publications

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“…The CEs in scCO 2 emulsions are all lower than those in the hexane emulsions. This phenomenon was not reported in a previous study on the ED-SCE of Ni [27]. The decrease in the CEs was suggested to be caused by the dissolution of Cu in the SCE.…”

Section: Comparison Of Current Efficiency Between Emulsions Of Scco 2contrasting

confidence: 83%

“…The CE was found to decrease with an increase in the volume fraction of the scCO 2 . In a previous study, this loss of CE was considered to be caused by the evolution of H 2 or increased electrical resistance after increasing the volume fraction of the nonelectrical conductive content, such as CO 2 [27]. The CEs in scCO 2 emulsions are all lower than those in the hexane emulsions.…”

Section: Comparison Of Current Efficiency Between Emulsions Of Scco 2mentioning

confidence: 96%

“…We have proposed an electrodeposition method with supercritical carbon dioxide (scCO 2 ) emulsions [26][27][28], which was named ED-SCE, as shown in Fig. 1, to reduce the formation of defects in the electrodeposited materials.…”

Section: Electrodeposition In Supercritical Carbon Dioxide Emulsions mentioning

confidence: 99%

“…Physical properties of hexane are similar to those of scCO 2 ; hence, hexane is used to confirm effects of scCO 2 in the ED-SCE [27]. Cu plate (99.99 mass%) with dimensions of 2.0× 1.0 cm 2 was used as the working electrode to evaluate surface morphology of the electrodeposited Cu films and measurement of the current efficiency (CE).…”

Section: Comparison Of Current Efficiency Between Emulsions Of Scco 2mentioning

confidence: 99%

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Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

Sone

2015

Electroplating of Nanostructures

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Novel electrodeposition (ED) techniques utilizing supercritical carbon dioxide (scCO 2 ) emulsions (SCE) are introduced. ScCO 2 has low surface tension and high compatibility with hydrogen. Thus, this method is applied in fine Cu wiring to allow the complete filling of Cu into nanoscale confined space. The electrochemical reactions are carried out in emulsions composed of an aqueous electrolyte, scCO 2 , and surfactants. Three aspects in fine Cu wiring will be introduced, which are the dissolution of the Cu seed layer in the SCE, the gap-filling capability of the ED-SCE, and the contamination in the plated Cu. At first, the dissolution of the Cu seed layer in the SCE was observed. In order to prevent the dissolution of the Cu seed layer, the addition of Cu particles into the SCE was found to be effective. The electrolyte containing the SCE and the Cu particles is named scCO 2 suspension (SCS). The gapfilling capability was evaluated using test element groups (TEGs) with patterns of vias with a diameter of 70 nm and an aspect ratio of 5. Many defects were observed in the vias filled using the conventional electrodeposition (CONV) method. On the other hand, defect-free fillings were obtained by the ED-SCS method. Because of the highpressure environment needed to form the scCO 2 , the reaction cells are usually batchtype high-pressure vessels. In order to improve the feasibility of the ED-SCS technique, a continuous-flow reaction system is also proposed and examined using a round-type large-area TEG with a diameter of 300 mm. Complete fillings were obtained for vias with a diameter of 60 nm and an aspect ratio of 5 on the large-area TEG. This result was in good agreement with that of the batch-type reaction system and demonstrated the successful application of the continuous-flow system with ED-SCS.

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Section: Comparison Of Current Efficiency Between Emulsions Of Scco 2contrasting

confidence: 83%

Section: Comparison Of Current Efficiency Between Emulsions Of Scco 2mentioning

confidence: 96%

Section: Electrodeposition In Supercritical Carbon Dioxide Emulsions mentioning

confidence: 99%

Section: Comparison Of Current Efficiency Between Emulsions Of Scco 2mentioning

confidence: 99%

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Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

Sone

2015

Electroplating of Nanostructures

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“…This, in part, is probably due to the aggressive nature of scNH 3 and the difficulties associated with generalising the method to the deposition of other materials. More recently, Sone and colleagues (17)(18)(19)(20) have demonstrated the electrodeposition of nickel from an emulsion of an aqueous nickelplating solution in scCO 2 . This method yields smoother, higher quality Ni films than deposition from water due to the total miscibility of the H 2 evolved during the electro-deposition with scCO 2 (21).…”

mentioning

confidence: 99%

Electrodeposition of metals from supercritical fluids

Howdle

et al. 2009

Proc. Natl. Acad. Sci. U.S.A.

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Electrodeposition is a widely used materials-deposition technology with a number of unique features, in particular, the efficient use of starting materials, conformal, and directed coating. The properties of the solvent medium for electrodeposition are critical to the technique's applicability. Supercritical fluids are unique solvents which give a wide range of advantages for chemistry in general, and materials processing in particular. However, a widely applicable approach to electrodeposition from supercritical fluids has not yet been developed. We present here a method that allows electrodeposition of a range of metals from supercritical carbon dioxide, using acetonitrile as a co-solvent and supercritical difluoromethane. This method is based on a careful selection of reagent and supporting electrolyte. There are no obvious barriers preventing this method being applied to deposit a range of materials from many different supercritical fluids. We present the deposition of 3-nm diameter nanowires in mesoporous silica templates using this methodology.electrochemistry ͉ nanomaterials

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Environmentally benign electroless nickel plating using supercritical carbon-dioxide on hydrophilically modified acrylonitrile–butadiene–styrene

Tengsuwan

Ohshima

2014

Applied Surface Science

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The effects of dense carbon dioxide on nickel plating using emulsion of carbon dioxide in electroplating solution

Cited by 40 publications

References 13 publications

Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

Electrodeposition of metals from supercritical fluids

Environmentally benign electroless nickel plating using supercritical carbon-dioxide on hydrophilically modified acrylonitrile–butadiene–styrene

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