The effects of stabilizers on the bath stability of electroless Ni deposition and the deposit

Cheong, Woo-Jae; Luan, B.; Shoesmith, David W.

doi:10.1016/j.apsusc.2004.02.003

Cited by 106 publications

(55 citation statements)

References 14 publications

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“…The nanocrystalline deposits were found to have a variable grain size distribution and minor differences in P content (¾7.5 wt%), depending on the type and concentration of the stabilizer used. 25 Nodular and cauliflower-type morphologies were observed for deposits prepared with TU, while smooth deposits were produced with no stabilizer or with MA. 25 In addition, the co-deposition of trace impurities has been claimed when using a TU stabilizer.…”

Section: 23mentioning

confidence: 96%

“…25 In addition, the co-deposition of trace impurities has been claimed when using a TU stabilizer. 26 -30 The presence of these impurities could lead to different surface reactions, resulting in alterations in the nature of the surface films formed on the EN specimens.…”

Section: 23mentioning

confidence: 98%

“…However, this work did not consider factors such as the morphology of the surface and any influence of the Pb stabilizer concentration used for the EN bath. Our previous research 25 indicated that small additions of stabilizers [thiourea (TU) and maleic acid (MA)] resulted in different microstructures of the Ni-P deposits. The nanocrystalline deposits were found to have a variable grain size distribution and minor differences in P content (¾7.5 wt%), depending on the type and concentration of the stabilizer used.…”

Section: 23mentioning

confidence: 99%

“…25 Four specimens were prepared with different TU (0.5 mg/L and 2.0 mg/L) and MA (1000 mg/L and 3000 mg/L) concentrations, and designated as TU0.5, TU2.0, MA1k, and MA3k, respectively. An additional reference (RE) specimen was prepared without any stabilizer.…”

Section: 23mentioning

confidence: 99%

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XPS characterization of the corrosion film formed on the electroless nickel deposit prepared using different stabilizers in NaCl solution

Cheong

Luan

McIntyre

et al. 2007

Surface & Interface Analysis

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X-ray photoelectron spectroscopy (XPS) was used to examine the corrosion films formed on electroless nickel (EN) deposits prepared in an EN solution containing two different types and concentrations of bath stabilizers in Ar-purged and oxygenated neutral 5% NaCl solution. Two distinctive corrosion films were observed after long periods of immersion. An enrichment of elemental phosphorus compared to nickel was observed on the surface of the EN deposit produced with no stabilizer and with maleic acid (MA). By comparison, a high degree of surface oxidation was observed on the EN deposit prepared with thiourea. Trace impurities of sulfur in the EN deposit prepared with thiourea appear to result in enhanced corrosion and, in turn, lead to the build-up of corrosion products on the EN surface. By contrast, a P-enriched chemical passivation layer was formed on the EN deposits prepared either without any stabilizer or with MA present. Copyright INTRODUCTIONThere has been a considerable interest in understanding the nature and properties of the oxide layers formed in aqueous solution on nickel and its alloys because a thin 0.9-1.2 nm film can confer passivity on the material. 1 -12 A bilayer model, composed of a top layer of nickel hydroxide [Ni(OH) 2 ] and a base layer of nickel oxide (NiO), is thought to be present. This model is supported by X-ray photoelectron spectroscopy (XPS) investigations. 1 -5 The XPS data reveal two fairly well resolved O 1s peaks at 529.8 eV and 531.6 eV, and these two peaks correspond well to the positions of oxygen in NiO and Ni(OH) 2 .1 However, these spectral features may also be interpreted differently since Ni 3C can give rise to spectral features very similar to those of Ni(OH) 2 . 6 The atomic structure of thin oxide films on metal surfaces is important in understanding the properties of passive films. 7 The first lateral and vertical atomic resolution ex situ STM imaging of an electrochemically produced passive oxide film on a single crystal Ni(111) electrode revealed it to be crystalline with a mosaic structure of crystallites 2-3 nm in size. 8 On the atomic scale, the film consists of a stepped crystalline lattice with a lattice parameter corresponding to the (111) orientation of NiO in 0.05 M H 2 SO 4 . The lattice mismatch between the oxide Ł Correspondence to: Woo-Jae Cheong, Reactor Chemistry & Corrosion Branch, Atomic Energy of Canada Limited, Chalk River, Ontario, K0J 1J0, Canada. E-mail: cheongw@aecl.ca; cheongw@gmail.com and the substrate resulted in the preferential epitaxial relationship. 7 -9 The atomic structure of the Ni(100) passive film in 1 M NaOH was later imaged with atomic resolution in situ. A well-ordered rhombic structure was identified at low oxidation potentials ( 0.7-0.5 V/Normal Hydrogen Electrode (NHE)), and at higher potentials (>0.18 V/NHE) a quasi-hexagonal structure was observed. 10 The in situ STM observation on single crystal Ni was also studied in acidic solution at pH 3.0.9,11 The first oxide layer on Ni(111) at 0.0915 V/Standard Hydrogen Elec...

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Section: 23mentioning

confidence: 96%

Section: 23mentioning

confidence: 98%

Section: 23mentioning

confidence: 99%

Section: 23mentioning

confidence: 99%

See 2 more Smart Citations

XPS characterization of the corrosion film formed on the electroless nickel deposit prepared using different stabilizers in NaCl solution

Cheong

Luan

McIntyre

et al. 2007

Surface & Interface Analysis

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“…Hence, in such cases, theoretical analysis is a powerful tool for the separate evaluation of these effects. For example, thiourea is a typical additive used for electroless deposition to control deposition conditions as well as properties of the deposited films; 21,22 it also works as an accelerator for deposition under acidic conditions, 23 and using the approach described above, we investigated the effect of thiourea on the oxidation reaction of hypophosphite ion at the Ni surface. Figure 6 shows the model describing the co-adsorption of thiourea and hypophosphite ion on the Ni surface, and Table 2 shows the calculated results of adsorption energy for hypophosphite ion.…”

Section: Theoretical Analysis On the Reaction Mechanism Ofmentioning

confidence: 99%

Electrochemical Processes for the Fabrication of Functional Micro–nano Structures and Devices: Mechanistic Understanding and Process Development

Homma

2015

Electrochemistry

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Electrochemical approaches for the fabrication of functional micro-nano structures and devices were comprehensively described primarily on the basis of the results obtained from previous studies conducted by the author's group with the aim of demonstrating the potential for achieving further precise controllability. First, a theoretical study was conducted for investigating the processes, mainly focusing upon electroless deposition to present an approach for analyzing its reaction mechanism from the molecular level. These approaches could be powerful tools for elucidating the overall process and could contribute toward achieving the precise design of processes. Second, some experimental approaches for achieving the precise control of micro-nano fabrication of functional structures, such as maskless and electroless fabrication of metal nano-patterns, lateral enhanced electrodeposition to form ultrathin layers, as well as the nanostructures for various devices by through-mask electrochemical deposition, were introduced to demonstrate high capability of the processes for nanoscale fabrication in various applications.

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The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

Wang

Hong

2009

AIChE Journal

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Bi 3þ -complex ion is presented here as a less toxic stabilizer for use in electroless nickel plating (ENP) to replace the existing Pb 2þ ion stabilizer. The asymmetric derivatives of EDTA are identified to be a type of coordination ligands that can combine with Bi 3þ ions to form soluble complexes in the acidic ENP solution. In the ENP system studied the Bi 3þ -complex ion displays a critical stabilizer concentration of about 10 À5 mol/L, that is, the percolation concentration over which the ENP rate drops sharply. Besides the experimental measurement, deposition rates of both Ni and P are also simulated by using a kinetic model that has been derived from the double electric layer theory. The Bi 3þ -complex ion, behaving like conventional Pb 2þ ion, stabilizes ENP bath through the chemical replacement reaction at the surface of Ni deposition layer and results in a passive plating surface. This investigation also verifies the properties of the EN deposit, which are insignificantly affected by the length of service time of the plating solution by employing Bi 3þ -complex ion stabilizer.

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The effects of stabilizers on the bath stability of electroless Ni deposition and the deposit

Cited by 106 publications

References 14 publications

XPS characterization of the corrosion film formed on the electroless nickel deposit prepared using different stabilizers in NaCl solution

XPS characterization of the corrosion film formed on the electroless nickel deposit prepared using different stabilizers in NaCl solution

Electrochemical Processes for the Fabrication of Functional Micro–nano Structures and Devices: Mechanistic Understanding and Process Development

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

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The effects of stabilizers on the bath stability of electroless Ni deposition and the deposit

Cited by 106 publications

References 14 publications

XPS characterization of the corrosion film formed on the electroless nickel deposit prepared using different stabilizers in NaCl solution

XPS characterization of the corrosion film formed on the electroless nickel deposit prepared using different stabilizers in NaCl solution

Electrochemical Processes for the Fabrication of Functional Micro&ndash;nano Structures and Devices: Mechanistic Understanding and Process Development

The role of Bi3+‐complex ion as the stabilizer in electroless nickel plating process

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Product

Resources

About

Electrochemical Processes for the Fabrication of Functional Micro–nano Structures and Devices: Mechanistic Understanding and Process Development

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process