2011
DOI: 10.1088/0022-3727/44/12/125101
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The electrical characterization and response to hydrogen of Schottky diodes with a resistive metal electrode—rectifying an oversight in Schottky diode investigation

Abstract: The electrical characterization and response to hydrogen of Schottky diodes with a resistive metal electrode-rectifying an oversight in Schottky diode investigation Dawson, P., Feng, L., Penate-Quesada, L., Mitra, J., & Hill, G. (2011 Abstract Schottky-barrier structures with a resistive metal electrode are examined using the 4-point probe method where the probes are connected to the metal electrode only. The observation of a significant decrease in resistance with increasing temperature (over a range of ∼100 … Show more

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Cited by 3 publications
(2 citation statements)
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“…Here, results from Pt/p-Si and Pd/p-Si devices are analyzed in detail, while we have reported a less in-depth survey of a broader range of Schottky contacts using this methodology elsewhere. 45 In the results discussed below, the metal electrode resistance lies in the range of 0.2-40 kX.…”
Section: Introductionmentioning
confidence: 96%
“…Here, results from Pt/p-Si and Pd/p-Si devices are analyzed in detail, while we have reported a less in-depth survey of a broader range of Schottky contacts using this methodology elsewhere. 45 In the results discussed below, the metal electrode resistance lies in the range of 0.2-40 kX.…”
Section: Introductionmentioning
confidence: 96%
“…The key feature here, and the crucial departure from conventional Schottky diode fabrication methodology, is that the very thin (<10 nm), elongated metal (Pd) electrode has a resistance that is greater than, or at least comparable to, the underlying InP substrate around room temperature. It is useful to first explain the device properties in terms of the R D -temperature behaviour (we have outlined this behaviour in relation to a variety of silicon-and III-V based Schottky devices [17] and will develop it more fully elsewhere [18]). In this scheme R D undergoes a significant drop from high values at low temperature, where the charge carriers are confined to the resistive metal electrode, to low values at high temperature, where the semiconductor substrate has opened up as a parallel current carrying channel.…”
mentioning
confidence: 99%