A fused salt bath for electrodeposition of molten cadmium ‐indium alloy is described, from which ellipsoidal beads of molten alloy are plated onto wires used as leads to emitter and collector electrodes of transistors. Electrodeposition of molten metals can be very rapid, and the deposits are smooth, dense, and nonporous. The fused salt bath, containing 6% cadmium chloride, 56% indium monochloride, and 38% zinc chloride, by weight, is operated at about 260°C. Tungsten anodes are used. With 6 v d.c. applied, a 2 mg ellipsoidal bead of cadmium ‐indium alloy of approximately eutectic composition can be deposited on a 0.5 mm wire that is immersed a depth of 1.5 mm into the plating bath in about 4 sec. Under these conditions, current density is of the order of 40 amp/cm2. The effect of bath composition and of plating conditions on alloy composition and plating rate is discussed.