The electrodeposition of silver composites using deep eutectic solvents

Abstract

Silver is an important metal for electronic connectors, however, it is extremely soft and wear can be a significant issue. This paper describes how improved wear resistant silver coatings can be obtained from the electrolytic deposition of silver from a solution of AgCl in an ethylene glycol/choline chloride based Deep Eutectic Solvent. An up to 10-fold decrease in the wear volume is observed by the incorporation of SiC or Al(2)O(3) particles. The work also addresses the fundamental aspect of speciation of silver chloride in solution using EXAFS to probe solution structure. The size but not the nature of the composite particles is seen to change the morphology and grain size of the silver deposit. Grain sizes are shown to be consistent with previous nucleation studies. The addition of LiF is found to significantly affect the deposit morphology and improve wear resistance.

Vibrational analysis and formation mechanism of typical deep eutectic solvents: An experimental and theoretical study

“…[12] These DESs have been widely applied as solvents or reaction mediums in many areas, including electrochemistry, biochemistry, material science, petrochemical engineering, and so on. [12][13][14][15][16][17][18][19][20][21][22][23][24][25] To date, although researches on DESs have made tremendous progress, there are few theoretical studies on DESs, especially the physicochemical properties of DESs, such as the formation mechanism, spectra properties, etc. [26][27][28][29][30][31][32][33][34] It is well known that the physicochemical properties of DESs have quite significance for further researches.…”

Structural and sliding wear properties of Ag/Graphene/WC hybrid nanocomposites produced by electroless co-deposition

“…9b, c and d respectively, the wear feature seems to shift from abrasive to mixed mode wear mechanism of adhesion and abrasion. Abbott and co-workers [41] have shown a similar change in wear mechanism when they introduced SiC, micro and Al 2 O 3 nano particles into Ag coatings using electrolytic deposition. It is seen from the Fig.…”

Latent Fingermarks Enhancement in Deep Eutectic Solvent by Co-electrodepositing Silver and Copper Particles on Metallic Substrates

“…1 mS cm -1 at 30 • C), which is comparable to those of most imidazolium based ILs. In addition, DES has been applied to the electrodeposition of Ag [28], Cu [29] and alloys like Zn-Co [30] and Zn-Sn [26] on metallic substrates. To our best knowledge, a method based on the electrodeposition of metallic particles in DES has not been reported to visualize the LFMs in forensic research field.…”