The equilibrium phase diagrams for the tantalum-tantalum bromide and tantalum-tantalum iodide systems

TaOx electron transport layers for CO2 reduction Si photocathodes

“…Looking towards this large-scale scenario, we sought to understand whether the proposed catalyst deposition method could be effectively scaled up, and we assessed the cost of production of a system incorporating a thin TaO x -Cu layer deposited on a silicon wafer, using pilot plant scale/semiindustrial coefficients for energy and gases used during the physical vapor deposition process, 43,44 and most recent price indicators for each component of the electrocatalytic system. [45][46][47][48] While other deposition methods reported here, such as RF sputtering, could further reduce the catalyst production cost, selecting physical vapor deposition (PVD) as a reference allows us to assess a less favorable scenario thus reducing the risk of overestimating the potential of the photocathode, being currently at an early development stage. Given the excellent reduction of the thickness of the catalyst, the manufacturing cost becomes practically reduced to the cost of the silicon wafer and the membrane (Fig.…”