The erosion behaviors of Y2O3 and YF3 coatings under fluorocarbon plasma

Kim, Dae Min; Oh, Yoon Suk; Kim, Seongwon; Kim, Hyun Jae; Lim, Dae Soon; Lee, Sung Min

doi:10.1016/j.tsf.2011.04.049

Cited by 77 publications

(52 citation statements)

References 13 publications

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“…Hence, the YF 3 coating is more favorable for application in plasma processing equipment. Similar results were consistent with the previously reported data by Kim et al [18]. …”

Section: Resultssupporting

confidence: 94%

Comparison of Erosion Behavior and Particle Contamination in Mass-Production CF4/O2 Plasma Chambers Using Y2O3 and YF3 Protective Coatings

et al. 2017

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Yttrium fluoride (YF3) and yttrium oxide (Y2O3) protective coatings prepared using an atmospheric plasma spraying technique were used to investigate the relationship between surface erosion behaviors and their nanoparticle generation under high-density plasma (1012–1013 cm−3) etching. As examined by transmission electron microscopy, the Y2O3 and YF3 coatings become oxyfluorinated after exposure to the plasma, wherein the yttrium oxyfluoride film formation was observed on the surface with a thickness of 5.2 and 6.8 nm, respectively. The difference in the oxyfluorination of Y2O3 and YF3 coatings could be attributed to Y–F and Y–O bonding energies. X-ray photoelectron spectroscopy analyses revealed that a strongly fluorinated bonding (Y–F bond) was obtained on the etched surface of the YF3 coating. Scanning electron microscopy and energy dispersive X-ray diffraction analysis revealed that the nanoparticles on the 12-inch wafer are composed of etchant gases and Y2O3. These results indicate that the YF3 coating is a more erosion-resistant material, resulting in fewer contamination particles compared with the Y2O3 coating.

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“…Hence, the YF 3 coating is more favorable for application in plasma processing equipment. Similar results were consistent with the previously reported data by Kim et al [18]. …”

Section: Resultssupporting

confidence: 94%

Comparison of Erosion Behavior and Particle Contamination in Mass-Production CF4/O2 Plasma Chambers Using Y2O3 and YF3 Protective Coatings

et al. 2017

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“…The proportional relationship was explained by the fact that those oxides generate highly volatile byproducts after the chemical reaction with fluorine plasma, and that result was also supported by Thienot et al [25]. Therefore, it is a very interesting result that SAY glass showed the lowest plasma etching depth among the glasses because Y generates the most volatile byproduct after the chemical reaction with fluorine plasma among the rare-earth elements in the glasses (Table 4) [21,22]. Physical and chemical etching occurs simultaneously during the plasma etching process [21,26,27].…”

Section: Discussionmentioning

confidence: 70%

“…It seems that the plasma etching test under various biases should be conducted to sufficiently understand the plasma etching behavior of the glass in the future. The degree of fluorination of each element in the glasses after the fluorine plasma exposure [21,22]. …”

Section: Resultsmentioning

confidence: 99%

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Effect of rare-earth elements on the plasma etching behavior of the RE–Si–Al–O glasses

Lee

Kim

Lee

et al. 2012

Journal of Non-Crystalline Solids

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“…he plasma processing apparatus for the semiconductor industry uses many ceramics as plasma-facing materials. [1][2][3][4][5][6][7][8] The plasma consists of reactive radicals and ions from fluorocarbon gases, which react with the ceramics and cause erosion. [6][7][8][9] Al 2 O 3 is a typical plasma resistant material and Y 2 O 3 is increasingly being used because of its superior plasma etching resistance.…”

Section: Introductionmentioning

confidence: 99%

Effect of Processing Parameters and Powder Size on Microstructures and Mechanical Properties of Y<sub>2</sub>O<sub>3</sub> Coatings Fabricated by Suspension Plasma Spray

Kim¹,

Lee²,

Oh³

et al. 2015

Journal of the Korean Ceramic Society

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The suspension plasma spray (SPS) technique has been used to obtain dense Y 2 O 3 coatings and to overcome the drawbacks of the conventional air plasma spray (APS). SPS uses suspensions containing micrometer or sub-micrometer sized powders dispersed in liquid media. In this study, microstructure developments and mechanical properties have been investigated as functions of particle size of source material and plasma processing parameters such as plasma power and stand-off distance. The microstructure of the coating was found to be highly related to the particle size and the plasma processing parameters, and it was directly reflected in the hardness and the adhesion strength. When fine powder (BET 16.4 m 2 /g) was used as a raw material in the suspension, there was, with increasing stand-off distance, a change from a dense structure with a slightly bumpy surface to a porous structure with a cauliflower-like surface. On the other hand, when a coarse powder (BET 2.8 m 2 /g) was used, the coating density was lower, with microscopic splats on the surface. Using fine Y 2 O 3 powders, the coating layer with an optimum short stand-off distance showed a high hardness of approximately 90% of that of sintered Y 2 O 3 and an adhesion strength several times higher than that of the coating by conventional APS.

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The erosion behaviors of Y2O3 and YF3 coatings under fluorocarbon plasma

Cited by 77 publications

References 13 publications

Comparison of Erosion Behavior and Particle Contamination in Mass-Production CF4/O2 Plasma Chambers Using Y2O3 and YF3 Protective Coatings

Comparison of Erosion Behavior and Particle Contamination in Mass-Production CF4/O2 Plasma Chambers Using Y2O3 and YF3 Protective Coatings

Effect of rare-earth elements on the plasma etching behavior of the RE–Si–Al–O glasses

Effect of Processing Parameters and Powder Size on Microstructures and Mechanical Properties of Y<sub>2</sub>O<sub>3</sub> Coatings Fabricated by Suspension Plasma Spray

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