The evaluation of Young's modulus and residual stress of copper films by microbridge testing

Zhang, Zhimin; Zhou, Yang; Yang, Chunsheng; Chen, J.A.; Ding, Wei; Ding, Guifu

doi:10.1016/j.sna.2005.12.036

Cited by 18 publications

(14 citation statements)

References 10 publications

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“…Regarding the mechanical properties, the Young’s modulus of the crystalline silicon is above 100 GPa, which is gradually decreased to 25 GPa along with increased lithiation to Li 3.75 Si . Compared to silicon, the Young’s modulus of copper is more than 120 GPa, which is comparable to the Young’s modulus of silicon. It indicates that copper is suitable as a buffer medium in the Si/C electrode.…”

Section: Introductionmentioning

confidence: 94%

Si/Cu/C Nanohybrid Lithium-Ion Battery Anode with in Situ Incorporation of Nonagglomerated Super-Small Copper Nanoparticles Based on Epoxy Resin

Fang

Cheng

et al. 2021

Energy Fuels

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Silicon anode has a huge potential to replace graphite anode. Nevertheless, it shows poor long-term cyclic stability and rate capability due to a huge volume change upon lithiation and intrinsic semiconductor property. In this manuscript, a silicon composite with nonagglomerated super-small sized copper nanoparticles (average diameter: 7 nm) was obtained. First, the supersmall copper nanoparticles (NPs) are beneficial to enhance the electron conductivity and electrochemical kinetics. Second, the copper NPs help to stabilize the electrode by absorbing mechanical stress. An amine based curing agent works as not only the solvent but also the carbon precursor. The thermosetting epoxy resin inhibits the agglomeration of the copper and silicon nanoparticles. Both silicon and copper nanoparticles are homogeneously dispersed in the carbon formed during the calcination under an inert atmosphere. The influence of the silicon and copper contents on the composition, structure, morphology, crystallinity, porosity, dispersion, and electrochemical performance of the Si/Cu/C nanohybrids are thoroughly studied by various techniques. The structure−property correlation of Si/Cu/C nanohybrids is investigated. A good balance among capacity, cyclic stability, and rate performance is achieved.

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Section: Introductionmentioning

confidence: 94%

Si/Cu/C Nanohybrid Lithium-Ion Battery Anode with in Situ Incorporation of Nonagglomerated Super-Small Copper Nanoparticles Based on Epoxy Resin

Fang

Cheng

et al. 2021

Energy Fuels

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“…Micro-bridge structure driven by electrostatic force is familiar in MEMS devices, such as changeable capacitors, RF switches, micro-resonators, pressure sensors, and so on. On one hand, it is a common structure being used to obtain the mechanical parameters of film, just like Young's Modulus, residual stress, yield strength and bending strength [3][4][5]. But on the other hand, MEMS devices with micro-bridge structure are often with low reliability and worse quality, which is induced by pull-in phenomena.…”

Section: Introductionmentioning

confidence: 99%

Analysis for Pull-In Voltage of a Multilayered Micro-Bridge Driven by Electrostatic Force

Liu¹,

Wang²,

Yang³

2010

ENG

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A trial solution for bending deflection of a multilayered micro-bridge subject to a voltage induced load is presented. The relation between the applied voltage and the displacements of the micro-bridge in the pull-in state is analyzed by energy method. Furthermore, two analytical expressions about normalized displacement and pull-in voltage are carried out. It’s proved that the value of normalized displacement is not influenced by residual stress if axial and shear deformation is ignored. Finally, the theoretical results are compared with that of FEM, and they show good agreement

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“…For 0.53 and 2.5‐µm solid Cu films fabricated at 0° e‐beam incidence the in‐plane modulus was derived from experimental wrinkle data as 119 ± 3 and 120 ± 3 GPa, respectively, which is in agreement with literature reports for solid Cu films and provides validation of the accuracy of the experimental procedure used in this study. [ 47,51 ] For solid Cu films deposited on PDMS at 20° e‐beam incidence, Specimens #5 and #6 in Table 3, the measured wrinkle wavelength was λ = 47.1 ± 1 µm and λ = 235.1 ± 3 µm for 0.5 and 2.5‐µm thick films, respectively (Figure 3c). Consistently for both 0.5 and 2.5‐µm thick films the extracted in‐plane compressive modulus averaged 94 ± 6 GPa.…”

Section: Resultsmentioning

confidence: 99%

Control of Surface Wrinkling through Compliant Nanostructured Interfaces

Hung

Chasiotis

2021

Adv Materials Inter

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Surface wrinkling occurs due to the mechanical instability induced by the stiffness mismatch between a soft substrate and a stiff film. In a two‐layer system comprised of a thick compliant substrate and a thin stiff film, the wrinkle pattern, as described by the wrinkle wavelength, amplitude, and orientation, is limited by the material properties and thickness of the two layers. In this work, an interface layer of nanostructures fabricated by glancing angle deposition (GLAD) is introduced to modify the surface wrinkling of polydimethylsiloxane due to a Cu film, thus enabling improved control of wrinkling in an otherwise constrained material system. Isotropic (nanospring) and orthotropic (nanochevron) Cu interfaces are GLAD‐deposited with different geometric parameters to control the in‐plane stiffness of the interface. The isotropic nanospring films provide a novel means to control the physical length scale of wrinkle patterns, namely, both the wavelength and the amplitude of surface wrinkles, while maintaining the amplitude‐to‐wavelength aspect ratio. The anisotropic nanochevron films result in anisotropy ratio of ≈10 which provides a unique means to modify the wrinkle direction independently of the direction of the applied load. The prediction by the experimentally calibrated analytical model is shown to be in good agreement with the experiment.

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The evaluation of Young's modulus and residual stress of copper films by microbridge testing

Cited by 18 publications

References 10 publications

Si/Cu/C Nanohybrid Lithium-Ion Battery Anode with in Situ Incorporation of Nonagglomerated Super-Small Copper Nanoparticles Based on Epoxy Resin

Si/Cu/C Nanohybrid Lithium-Ion Battery Anode with in Situ Incorporation of Nonagglomerated Super-Small Copper Nanoparticles Based on Epoxy Resin

Analysis for Pull-In Voltage of a Multilayered Micro-Bridge Driven by Electrostatic Force

Control of Surface Wrinkling through Compliant Nanostructured Interfaces

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