The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing

Tian, Yu; Wang, Yishu; Guo, Fu; Ma, Limin; Han, Jing

doi:10.1007/s11664-018-06907-8

Cited by 9 publications

(1 citation statement)

References 35 publications

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“…Propelled by the market demand for electric vehicles and portable electronics, the application of high-power and integrated chips led to an elevation in the service temperature of micro-solder joints [1][2][3]. Cu/Sn micro-solder joints were widely used as the interconnection system in 3D packaging, and the intermetallic compounds (IMCs) generated at the Cu/Sn interface usually consisted of a Cu 6 Sn 5 layer and a Cu 3 Sn layer with Kirkendall voids [4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading

Cheng

Liu

et al. 2023

Materials

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Ni-xCu/Sn soldering joints were aged at 200 °C, and the microstructure evolution and mechanical properties during the solid-state reaction were studied under shear loading. Results showed that the intermetallic compounds (IMCs) exhibited a Cu content-dependent transformation from the (Ni,Cu)3Sn4 phase to the (Cu,Ni)6Sn5 phase at the Ni-xCu/Sn interface. Furthermore, a Cu3Sn layer was observed exclusively at the Cu/Sn interface. The shear strength of the soldering joints after thermal aging exhibited an initial decrease followed by an increase, except for a significant enhancement at the Cu content of 60 wt.%. In addition, the evolution law of mechanical properties and failure mechanism of the thermal aging joints were elucidated based on the fracture microstructure and the fracture curve of the joints.

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