The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Seo, Sun-Kyoung; Kang, Sung K.; Shih, Da‐Yuan; Lee, Hyuck Mo

doi:10.1016/j.microrel.2008.11.014

Cited by 76 publications

(35 citation statements)

References 16 publications

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“…Therefore, a highspeed ball pull test was also carried out on aged Sn-Pb, SAC105, SAC305, and SAC405 solder joints on Cu-OSP; the aging process was performed at 150 • C for 100 h to cause a noticeable microstructural change in IMC layers for comparison to multiple-reflowed samples and results from previous literature [11,[17][18][19]. Figs.…”

Section: Resultsmentioning

confidence: 99%

Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading

You

Jung

Moon³

et al. 2009

Journal of Alloys and Compounds

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Section: Resultsmentioning

confidence: 99%

Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading

You

Jung

Moon³

et al. 2009

Journal of Alloys and Compounds

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“…The EM lifetime of SnCu joints is generally shorter than Sn-Ag or Sn-Ag-Cu joints. The better EM performance of Sn-Ag over Sn-Cu is explained by the stable network of Ag 3 Sn particles during EM or hightemperature aging experiments [101].…”

Section: Enhancing Electromigration Resistancementioning

confidence: 98%

‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

Kang¹

2012

Lead‐Free Solders: Materials Reliability for Electronics

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Since July, 2006, following the EUs RoHS legislation, the consumer electronics industry has been offering 'green' products by eliminating Pb-containing solders and other toxic materials. This transition has been relatively smooth, because the reliability requirements are less stringent. However, the Pb-free transition for high-performance electronic systems (such as servers and telecommunication) is still on-going due to their rigorous reliability requirements. For example, the research and development efforts to implement Pb-free flipchip interconnections for high-end applications are still very active.In this chapter, the recent progress in Pb-free solder development, especially minor alloy additions to Sn-rich solders is reviewed in light of improving various physical, mechanical, metallurgical or electrical properties of solder joints. The topics to be discussed include those such as control of undercooling, microstructure, interfacial reactions, or void formation, as well as enhancing impact resistance, electromigration, and other mechanical properties.

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“…Unlike Sn-37Pb solders producing a lamella-eutectic structure, Pb-free solders produce dispersed Ag 3 Sn with a fibrous form around the primary β-Sn [24,25]. Ag 3 Sn is a thermally stable compound because of the limited solubility of Ag in β-Sn [26,27]; therefore, it strengthens the eutectic structure. Ag 3 Sn is one of the components in the eutectic mixture for Sn-rich Pb-free solders containing Ag content.…”

Section: Effect Of Solder Composition On Microstructurementioning

confidence: 99%

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

Park

Bang

et al. 2017

Metals

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Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 • C under driving conditions. Therefore, it is necessary to study the high-temperature reliability of solder joints. This study investigated the creep properties of Sn-3.0Ag-0.5Cu (SAC305) and Sn-8.0Sb-3.0Ag (SSA8030) solder joints. The creep test was conducted at 175 and 190 • C with the application of 2.45 MPa. The SAC305 solder had superior creep properties to those of SSA8030 solder at 175 • C and at largely the same homologous temperature (T H~0 .91 for SAC305 and T H~0 .92 for SSA8030). Both solders had primary β-Sn and a eutectic mixture of β-Sn and Ag 3 Sn. Compared to SSA8030, the SAC305 solder contained~10% more eutectic structure and contained Ag 3 Sn that was 3 times smaller and more round in shape. Furthermore, the SSA8030 solder precipitated SnSb in an elongated fiber shape (1-50 µm in size) after the creep test. Coarse and elongated Ag 3 Sn and SnSb of the SSA8030 solder negatively affected crack propagation in the dislocation creep region and decreased the creep resistance.

show abstract

The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Cited by 76 publications

References 16 publications

Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading

Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading

‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

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