The evolution of packages for monolithic microwave and millimeter-wave circuits

Midford, T.A.; Wooldridge, J.; Sturdivant, Rick

doi:10.1109/8.410215

Cited by 40 publications

(12 citation statements)

References 9 publications

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“…Also, 0.7 mil wire bonding and 10 mil ribbon bonding are used to assemble the VCO. It requires careful fabrication skills as the tolerance error must have an influence on the system characterization [11] .…”

Section: Test Resultsmentioning

confidence: 99%

The MMIC VCO Design for Wireless Systems at Ka-Band

Lee¹,

Kim²

2010

Journal of Electrical Engineering and Technology

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-Reconfigurable radio technology is needed to reconstruct frequency and modem functionality, which can be different in various regions. In addition, it makes a single mobile handset capable of supporting various standards of wireless communication and thus plays a key role in mobile convergence. An MMIC VCO (voltage controlled oscillator) has been developed for high power and wide bandwidth where Clapp-Gouriet type oscillators are adapted for series feedback, and was fabricated based on 0.15um pHEMT of TRW. The MMIC VCO was connected to an aluminar substrate on the carrier for testing. This MMIC VCO module showed good performance in comparison to existing works. Furthermore, it can be potentially extended to reconfigure an MMIC VCO for wireless systems such as military applications and satellite communications.

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Section: Test Resultsmentioning

confidence: 99%

The MMIC VCO Design for Wireless Systems at Ka-Band

Lee¹,

Kim²

2010

Journal of Electrical Engineering and Technology

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“…MMIC dies/chips require mechanical support as well as thermal and electrical protection. These can be provided by reliable packaging that preserves the electrical performance of the enclosed MMICs [34]. Plastic, metal, ceramic, and thin-film multilayer packages have been used in the design of MCMs [35], [36].…”

Section: Implementation Of the Rf Section In An MCMmentioning

confidence: 99%

A Miniaturized Spectrometer Radiometer Based on MMIC Technology for Tropospheric Water Vapor Profiling

Iturbide-Sanchez

Reising

Padmanabhan

2007

IEEE Trans. Geosci. Remote Sensing

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Abstract-The fabrication of a miniaturized ground-based water vapor profiling radiometer demonstrates the capability of monolithic microwave and millimeter-wave integrated circuit technology to reduce the mass and volume of microwave remote sensing instrumentation and to reduce substantially the necessary operational power consumption and size of the radiofrequency and intermediate-frequency sections. Since those sections comprise much of the mass and volume of current microwave receivers, the fabrication of this system represents an important contribution to the design of microwave radiometers. This miniaturized radiometer implementation is particularly well suited to benefit from the cost savings associated with mass production. The small size of the radiometer (24 × 18 × 16 cm) reduces the power required by the temperature control system and allows a rapid warm-up to the temperature set point as well as maintenance of a highly stable internal temperature. Exhibiting very similar statistical properties, the four channels of the radiometer have measured Allan times of greater than 40 s. Measurement results demonstrate that the instrument achieves a sensitivity of better than 0.2 K for 3 s of integration time. Preliminary comparisons of measured brightness temperatures with simulation results based on radiosonde data show good agreement, which are consistent with previously reported results.Index Terms-Atmospheric measurements, humidity measurement, microwave radiometry, monolithic microwave and millimeter-wave integrated circuits (MMICs), multichip modules (MCMs), remote sensing.

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“…High reliability RF MEMS devices or SAW/BAW devices should be placed in a hermetic environment to protect them from the surrounding elements such as humidity and contamination [1], [2]. Very low insertion and return loss, resonancefree operation and good isolation are the basic requirements for a microwave package.…”

Section: Introductionmentioning

confidence: 99%

A Low-Loss Microstrip Surface-Mount K-Band Package

Entesari

Rebeiz

2006

2006 European Microwave Conference

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This paper presents a hermetic-compatible surface mount package for microstrip structures designed for K-band applications. The microstrip lines, fabricated on a 250 μm-thick alumina substrate are packaged using a 280 μm-thick silicon cap wafer and gold-gold thermo-compression bonding. A 130 μm cavity is etched in the cap wafer to allow ample space for RF MEMS devices, surface-or bulk-wave acoustic filters, power amplifiers, or multi-chip assemblies. A via-hole transition is used to connect the microstrip line inside the package to the coplanar waveguide (CPW) line on the back side of the alumina wafer. The gold sealing ring is connected to the microstrip ground using via-holes through the alumina wafer to eliminate any parasitic resonance modes and to improve the isolation between the input and output ports. A packaged microstrip line with total dimensions of 2.6 mm has a measured insertion loss and return loss of less than 0.5 dB and 18 dB, respectively, at DC-23 GHz.

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The evolution of packages for monolithic microwave and millimeter-wave circuits

Cited by 40 publications

References 9 publications

The MMIC VCO Design for Wireless Systems at Ka-Band

The MMIC VCO Design for Wireless Systems at Ka-Band

A Miniaturized Spectrometer Radiometer Based on MMIC Technology for Tropospheric Water Vapor Profiling

A Low-Loss Microstrip Surface-Mount K-Band Package

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