The fracture behavior of diffusion-bonded duplex gamma TiAl

Çam, Gürel; Bohm, Karl Heinz; Müllauer, J.; Koçak, M.

doi:10.1007/bf03223248

Cited by 39 publications

(5 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Investigations on the fracture surfaces of the specimens failing at the bond interface showed that fracture surface topography becomes rougher as the bond temperature increases, as discussed in Refs. [25][26][27]. It was also observed …”

Section: Introductionmentioning

confidence: 90%

Diffusion bonding of two phase γ-TiAl alloys with duplex microstructure

Çam¹,

Müllauer²,

Koçak³

1997

Science and Technology of Welding and Joining

Self Cite

View full text Add to dashboard Cite

Solid state diffusion bonding of TiAI was carried out with different bonding parameters within the superplastic temperature range. The effect of post-bond heat treatment (P BHT) on the mechanical properties of the bonds was also studied. Defect free sound bonds were achieved within the temperature range 925-1150 0 e and the pressure range 20-40 MPa. Transverse microtensile specimens extracted from the bonds lvere tested to evaluate room temperature tensile properties of the bonds and to correlate them with bonding parameters. The bond strength increased with an increase in bonding temperature and pressure. All the specimens of the bond made at 925°e and 40 MPa, and most of the specimens of bonds made at 1000°e and 30 MPa and at 1100 0 e and 20 MPa, failed in the bond area; all the specimens of bonds made at 1100°e and 30 MPa and at 1150 0 e and 20 MPa failed in the base metal. Post-bond heat treatment at 1350 0 e for 1 h led to the transformation of the recrystallised )I grains at the bond inte7iace formed during bonding to a lamellar microstructure, resulting in an indiscernible bond line in all cases. This resulted in an improvement in the bond strength in most of cases. Moreover, the recrystallised )I grains were also formed away from the bond area in the bonds made at 1100 0 e and 30 MPa and at 1150 0 e and 20 MPa. After PBHT, these bonds exhibited slightly lower tensile strength values owing to the change in the base metal microstructure away from the bond area.

show abstract

Section: Introductionmentioning

confidence: 90%

Diffusion bonding of two phase γ-TiAl alloys with duplex microstructure

Çam¹,

Müllauer²,

Koçak³

1997

Science and Technology of Welding and Joining

Self Cite

View full text Add to dashboard Cite

show abstract

“…Since diffusion bonding causes little/no changes to mechanical properties of the parent material, there is usually very little need for post-weld heat treatment, especially given the small heat-affected zone when resistance or induction heating methods are employed [15]. Thus, diffusion bonding has been widely used to join Ti alloys including Ti 6-4 alloy [16][17][18][19][20][21][22]. A schematic of the diffusion bonding process is shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

Powder interlayer bonding of geometrically complex Ti-6Al-4V parts

Watkins

Davies

Stanners

et al. 2019

Int J Adv Manuf Technol

View full text Add to dashboard Cite

Powder interlayer bonding (PIB) is a novel joining technique, which has been developed to facilitate high-integrity repairs of aerospace components, manufactured from commonly used titanium alloys. The PIB technique utilises an interlayer between complex geometric components which are mated under pressure and a highly localised heating source. In this study, induction heating enabled bonding in an inert fusion zone by use of an oxygen-displacing shielding gas, with particular attention to the initial heating and pressure application. These early stages proved crucial to the elimination of pores and consolidation of the alloy powder, with porosity volume fraction reduced to just 0.5% after just 20 sec at the bonding force. The technique has produced high-integrity bonds in alloys such as Ti-6Al-4V, retaining approximately 90% of the alloy strength in previous studies, offering advantages over established joining methods such as tungsten inert gas (TIG) and plasma arc (PA) welding due to a more highly localised heating and fusion zone. It is believed that powder interlayer bonding can compete against these techniques, providing a more time and cost-effective repair route for net shape components manufactured from a range of alloys with minimal post-processing.

show abstract

“…Conventional joining techniques are further of two types namely fusion joining techniques and solid state joining techniques. Fusion joining techniques involve arc welding, oxy-fuel gas welding, and tungsten inert gas welding; while solid state joining techniques include friction welding and diffusion bonding [1,2]. These techniques are used where cost is more important.…”

Section: Introductionmentioning

confidence: 99%

Low cost joining of SS304-SS304 through microwave hybrid heating without filler-powder

et al. 2019

View full text Add to dashboard Cite

In this paper, a novel microwave joining technique for SS304-SS304 has been proposed, implemented and optimized, which does not require any filler-material at the joint interface. Absence of fillerpowder drastically reduces the material cost of the joining process. The vertical cavity-type charcoal feeder has been used to concentrate heating effect around the joint region. Results of physical and mechanical characterization tests confirm the achievement of good homogeneity, hardness, tensile strength, and ductility in the joint region. Additionally, the process time has been optimized under geometric constraints on diameter and height of cavity. Optimization results show that the fastest joining process is achieved when cavity diameter and height are set to be 15 mm and 31.1 mm respectively.

show abstract

The fracture behavior of diffusion-bonded duplex gamma TiAl

Cited by 39 publications

References 2 publications

Diffusion bonding of two phase γ-TiAl alloys with duplex microstructure

Diffusion bonding of two phase γ-TiAl alloys with duplex microstructure

Powder interlayer bonding of geometrically complex Ti-6Al-4V parts

Low cost joining of SS304-SS304 through microwave hybrid heating without filler-powder

Contact Info

Product

Resources

About