2009 Proceedings of the European Solid State Device Research Conference 2009
DOI: 10.1109/essderc.2009.5331369
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The future of high frequency circuit design

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Cited by 4 publications
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“…reduce manufacturing cost since both RF front-end and digital baseband can be integrated together to create a single chip implementation [2], [3].…”
mentioning
confidence: 99%
“…reduce manufacturing cost since both RF front-end and digital baseband can be integrated together to create a single chip implementation [2], [3].…”
mentioning
confidence: 99%