Microstructural and texture evolution during grain growth in polycrystalline thin films was investigated. Grain growth in thin films is a coarsening process driven by the reduction of grain boundary energy, surface energies, and strain energy density. Because crystal properties can be anisotropic, grain growth in thin films is an orientation selective process. Surface and interfacial energy minimization or reduction favors the growth of grains with low combined surface and interfacial free energy. For the films and substrates investigated in this thesis, surface and interfacial energy promotes the growth of (111)-textured grains. Thin films on thick substrates are usually subjected to a non-zero state of strain, arising from differential thermal expansion between the film and the substrate, from densification and from intrinsic strains. For elastically deformed fcc metal films, strain energy density promotes the growth of (001)-textured grains. In plastically deformed films, strain energy density can favor the growth of (011)-textured grains; this results from the orientation dependence of the yield stress of grains in thin films. (111) grains are predicted to maximize the yield stress, and (011) grains are predicted to have low yield stress. An analytic model for texture evolution during grain growth in thin films can be developed by equating the magnitudes of the orientation-dependent driving forces, for pairs of orientations. The analytic model can be used to generate texture maps that define which orientations are expected to grow preferentially as a function of the processing conditions, i.e., the deposition temperature, the grain growth temperature, and the film thickness. Experimental texture maps can be generated and used to test the validity of the analytic model.Computer simulations of grain growth have been carried out using a front-tracking simulation method. Interfacial energy, elastic and plastic strain energy density, and grain growth stagnation are accounted for in the simulations. Materials parameters characteristic of Ag/(001)Ni were used. The main result of the simulations is to validate the analytic model for texture evolution during grain growth. The computer simulations also provide insights into the coupling between yielding and grain growth.Grain growth experiments in Ag/(001)Ni/(001)Ag/(001)MgO, Ag/SiO2/MgO, Ag/SiO 2 /Si, Ni/SiO 2 /Si, and Al/SiO 2 /Si were carried out. Both the thickness and the thermal strain were systematically varied, and an experimental texture map was constructed for each system. The dependence of texture evolution on strain and thickness was found to be consistent with the trends predicted by the analytic model in all of these systems. While the texture map for Ag/(001)Ni was found in quantitative agreement with the model, with no adjustable parameters, no single set of fitting parameters was found for Ag/SiO 2 /Si and for Ag/SiO 2 fMgO. Possible origins of this discrepancy are discussed.Additional experiments are proposed that could provide a better under...