The heat treatment effect on microstructure and dynamic mechanical properties of electroformed nanocrystalline Ni–W alloy

Wang, Y.C.; Zhao, Dingwei; Li, S.K.; Liu, J.X.; Wang, F.C.

doi:10.1016/j.msea.2012.03.091

Cited by 17 publications

(2 citation statements)

References 8 publications

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“…6 This increase of internal stress with increased current density could be explained by the increase in the rate of metal alloy deposition and speed of crystal growth. 23,24 The ultra-low internal stress at pH = 3.3 could be explained by morphology. The test samples obtained at pH below 3.0 show visual cracks and defect formation.…”

Section: Thermal Properties -Thermal Heat Capacity Heat Conductivity-mentioning

confidence: 98%

“…This adsorption blocks the reduction of metal ions and enhances cathode polarization, which increases metal crystal nucleation numbers and slows the growth speed of the crystals. 23,24 Additionally, pulsed current (10 ms ON and 10 ms OFF) was utilized to reduce the stress and further prevent film delamination, which may occur at INVAR composition. 1 Based on Hirano, 19 the internal stress of INVAR deposited at current density of about 20 mA/cm 2 is below 100 MPa while deviation of the Fe from the INVAR composition leads to significant stress increase up to 200 MPa at 38% Fe.…”

Section: Thermal Properties -Thermal Heat Capacity Heat Conductivity-mentioning

confidence: 99%

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Invar Electrodeposition for Controlled Expansion Interconnects

Dubin¹,

Lisunova²,

Walton³

2017

J. Electrochem. Soc.

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In this work, we developed an electroplating technique to produce uniform, low-internal-stress and controlled-expansion nickel iron alloy (36% of Nickel and 64% of Iron (INVAR)) films deposited on different substrates to fabricate redistribution layers (RDL), through silicon vias (TSV) interconnects, pillars, bumps, pads and free standing foils. The linear thermal expansion of the INVAR deposits was measured down to 0.4 ± 0.1 (x10 −6 , K −1 ) within a process window that corresponds to ultra-low internal stress (30 ± 2 MPa) and low surface roughness (Ra ∼2 nm). Thermal conductivity and specific heat capacity of the INVAR pinhole-free films were found to be in the range of 43 ± 5 W/mK and 0.45 ± 0.05 J/gK, respectively. Ultra-high ductility of about 40 ± 10 % has been obtained for free standing INVAR films, which possess high tensile strength of 500 ± 60 MPa and yield strength of 280 ± 50 MPa.

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Section: Thermal Properties -Thermal Heat Capacity Heat Conductivity-mentioning

confidence: 98%