materials are barely manifested owing to the large contact resistances and uncontrolled channel doping levels in such devices. [12,13] In the fifty year successful history of silicon metal-oxide-semiconductor (MOS) technology, silicon triumphed over germanium, which has even higher mobility than silicon. The key to the success of silicon MOS technology is the use of readily formed stable silicon oxide as gate dielectric and passivation layer. [14] However, silicon has reached its physical limit of downward scaling. [15] Emerging 2D materials have joined the race to potentially replace silicon. Similar to the case of the original silicon MOS technology, the importance of the gate dielectric and surrounding passivation dielectric should not be underestimated in constructing 2D-material-based electron devices. It has been reported that the performances of 2D FETs are improved when they are built on diamond-like carbon, [16] boron nitride, [17] and high-k dielectrics, [18] due to suppressed surface and interface scattering. [19,20] Although most of the reported 2D FETs use SiO 2 as the back-gate dielectric to easily identify the ultra-thin exfoliated 2D materials by optical microscope, it is unlikely that SiO 2 will be used in the final integration process. The operating voltage and power consumed would be much larger than current mainstream technology. Considering the ever-increasing demand for mobile computation in portable electronics, low-power and low-voltage operation is a prerequisite for any emerging semiconductor material aiming to be the successor to silicon technology. This requirement translates into the application of high-k or ultra-high-k dielectrics in 2D electron devices.Regarding the choices of high-k dielectrics, those already mature in current technology, such as HfO 2 , Al 2 O 3 , etc., formed by atomic layer deposition (ALD), are being investigated. [21][22][23] There are many challenges to directly integrating these high-k dielectrics with 2D materials due to the lack of dangling bonds on 2D material surfaces. On the other hand, there are many functional materials featuring high-k properties along with other unique properties such as ferroelectricity, [24,25] ferromagnetism, piezoelectricity, [26] and electro-optical properties. [27] As well as allowing low-voltage operation, these high-k properties expand the functionality of current electronic systems with the integration of functional materials. [28] Furthermore, 2D materials prove even more versatile when integrated with functional materials.Two-dimensional (2D) materials have the potential to extend state-of-theart semiconductor technology to sub-nanometer scales and have inspired numerous research efforts exploring novel device structures. The key elements of electron devices, including low-resistance contacts and reliable gate dielectrics, have to be optimized to complete a functional device. This review highlights recent studies on the integration of ferroelectrics with 2D materials to implement 2D electron devices. The high polarizatio...