“…17,18 In certain instances, additional alloying elements, namely, Cr, Mo, Cu, Co, and Mn, are intentionally introduced into these alloys to augment their performance in a variety of applications. 13,[19][20][21][22] Tian et al studied the bonding process of α-SiC using Ni-Si-Ti fillers and noticed the formation of Ni 3 Si 2 and Ni-Si phases at the interface. 23 Their findings demonstrated that the presence of Ti promotes the formation of a novel compound, Ni 49 Ti 14 Si 37 , within the interlayer region, in addition to the existing Ni-Si compounds (e.g., Ni-Si and Ni 3 Si 2 ).…”