The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content

Keim, Simon; Tetzlaff, Ulrich; Elger, Gordon

doi:10.1109/ectc32862.2020.00312

Cited by 1 publication

(1 citation statement)

References 18 publications

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“…Furthermore, Pan et al (2004) examined the effects of aperture size, aperture form, board finish, stencil thickness, solder type and print speed. Yakymovych et al (2018), Keim et al (2020) and Narayan and Prabhu (2013) investigated the importance of the soldering process in achieving good electrical conductivity. In the soldering process, wetting behavior and spreading processes of molten solder on the substrate are indicators of good solderability.…”

Section: Introductionmentioning

confidence: 99%

Effect of alloy particle size and stencil aperture shape on solder printing quality

Sunar¹,

Bakar

Jalar

et al. 2022

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Purpose Reflow solder joint quality is significantly affected by the ability of the solder to perfectly fill pad space and retain good solder joint shape. This study aims to investigate solder joint quality by quantitatively analyzing the stencil printing-deposited solder volume, solder height and solder coverage area. Design/methodology/approach The dispensability of different solder paste types on printed circuit board (PCB) pads using different stencil aperture shapes was evaluated. Lead-free Type 4 (20–38 µm particle size) and Type 5 (15–25 µm particle size) solder pastes were used to create solder joints according to standard reflow soldering. Findings The results show that the stencil aperture shape greatly affects the solder joint quality as compared with the type of solder paste. These investigations allow the development of new strategies for solving solder paste stencil printing issues and evaluating the quality of solder joints. Originality/value The reflow soldering process requires the appropriate selection of the stencil aperture shape according to the PCB and the solder paste according to the particle-size distribution of the solder alloy powder. However, there are scarce studies on the effects of stencil aperture shape and the solder alloy particle size on the solder paste space-filling ability.

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