The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly

Ani, F. Che; Jalar, Azman; Saad, Abdullah Aziz; Khor, C. Y.; Ismail, Roslina; Bachok, Zuraihana; Abas, Aizat; Othman, Norinsan Kamil

doi:10.1007/s00170-018-1583-z

Cited by 17 publications

(6 citation statements)

References 24 publications

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“…These results reveal that partial recrystallization prompts the induction of soft/hard domain interfaces. This finding has already been confirmed and is consistent with other research results [15]. been widely reported in heterostructure materials [17,18,24].…”

Section: Resultssupporting

confidence: 93%

“…However, the most advanced techniques for microstructure refinement involve the reinforcement of nanoparticles to lead-free solders, resulting in substantial improvements in mechanical properties and reliability. It emerged that dispersing active nanoparticle including; TiO 2 [13], SiO 2 [14], CeO 2 [6], Fe 2 O 3 [15], and Al 2 O 3 [16], in solder alloy matrix enhances the wettability, microstructure, mechanical strength and suppresses the IMC growth. Among these particles, TiO 2 has been considered one of the suitable nanoparticles for the development a novel solder alloy.…”

Section: Introductionmentioning

confidence: 99%

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Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite

Eid,

El-Daly,

Hammad

et al. 2023

Phys. Scr.

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The use of innovative Co-Mg-La ferrite nanoparticles (ferrite) facilitates the production of superior Pb-free solder alloy materials that suffer from the strength-ductility trade-off (SDT). The current study introduces an original Pb-free Sn-1Ag-0.5Cu (SAC105) electrical connection alloy. It is fortified with cutting-edge ferrite and nickel providing a novel approach for improving SDT by avoiding early necking throughout different temperatures. The heterogeneous structures in Sn-1Ag-0.5Cu (SAC105) alloy are assembled by controlling a fraction of reinforcing ferrite and Ni, processed under cold-drawn and partial recrystallization. The optimal ferrite concentration in SAC105 composites is about 0.3wt%, which possesses a significant strain hardening potential and the highest strength-ductility synergy. The excessive degree of heterogeneity of SAC105-0.3ferrite induces numerous strengthening mechanisms and dislocation accumulation, resulting in attaining high ultimate tensile strength (UTS) of 40.7 MPa with significant ductility of ∼ 47.7%, with ∼ 34.3% and 39% increasing when compared to SAC105. Once SAC105 solder was doped with 0.3 wt.% ferrite or 0.05Ni with 0.3 wt.% ferrite, the activation energy transferred from pipe diffusion to lattice diffusion. The solitary Ni addition, on the other hand, results in the SDT of plain SAC105.

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Section: Resultssupporting

confidence: 93%

Section: Introductionmentioning

confidence: 99%

Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite

Eid,

El-Daly,

Hammad

et al. 2023

Phys. Scr.

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“…Based on the observations of Table 5 and Table 6, comparing the nanoparticles distributions to each increasing temperature, the nanoparticles seem to be accumulated towards each other at lower temperature and they tend to be evenly distributed at the higher position of the molten solder fillet at higher temperature. This is identified to be the result of nanoparticles' buoyancy effect towards the molten solder [26]. Generally, buoyancy effect happens when the density of molten solder is higher than of nanoparticles.…”

Section: Soaking and Wetting Regionmentioning

confidence: 95%

Effect of Peak Temperature on SAC Nano-Reinforced Fillet Height

Mukhtar¹,

Abas²,

Ani³

et al. 2020

CFDL

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Recently, the addition of new materials into the conventional solder pastes provides a viable solution to optimize the material characteristics and properties of the nanoparticle filled solder paste. Addition of titanium oxide (TiO2) nanoparticles shown that it can enable better performance of the solder. However, actual industry experiment in terms of its optimum thermal profile for improved strength through good spread of nano-particles in the solder is very costly and lengthy to set up. Hence, this paper presents a preliminary study of the interaction between two models of numerical simulation namely volume of fluid (VOF) and discrete phase model (DPM) then compare with previous experimental data. This paper aims to analyse the effect of peak temperature towards the fillet height of ultra-fine SnAg -Cu (SAC) solder joints doped with TiO2 nanoparticles in an electronic assembly. For the purpose of this research, the weight percentage of the nanoparticles TiO2 with the SAC305 lead-free reinforced solder is varied at different peak temperature and investigated in terms of particles distribution, fillet height and thermal strain. This paper presents a 3D numerical simulation of nano-reinforced lead (Pb)-free solder at the ultra-fine joint component for 01005 capacitor with dimension of 0.2 x 0.2 x 0.4 mm³. The results obtained are confirmed by conducting an experiment using a field emission scanning electron microscope (SEM) joined with an EDS and X-ray diffraction machine. This study concludes that the best fillet height would be obtained at 250°C. The distributions of nanoparticles with 0.01 wt%, 0.05 wt%, and 0.15 wt% of weighted percentage are effectively observed by using the HRTEM analysis. Based on the study, higher temperature of the wetting region that range between 240°C and 255°C results in better particle distributions, and fillet height of the solder by using temperature in that range meets the requirement of IPC standards.

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“…Examples of the models include Solomon, Engelmaier and Coffin–Manson models (Wang and Tang, 2019; Depiver et al , 2020; Pan et al , 2020). The damage-accumulation models have also been developed to investigate solder joints' thermal fatigue failure mechanism (Apalowo et al , 2024; Che Ani et al , 2018). The models have the potential to predict the initiation and propagation of damage within the joint.…”

Section: Introductionmentioning

confidence: 99%

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Apalowo,

Abas,

Che Ani

et al. 2024

SSMT

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Purpose This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling. Design/methodology/approach The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method. Findings The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints. Practical implications Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism. Originality/value Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

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The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly

Cited by 17 publications

References 24 publications

Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite

Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite

Effect of Peak Temperature on SAC Nano-Reinforced Fillet Height

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

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