The influence of interface bonding on thermal transport through solid–liquid interfaces

Abstract

We use time-domain thermoreflectance to show that interface thermal conductance, G, is proportional to the thermodynamic work of adhesion between gold and water, WSL, for a series of five alkane-thiol monolayers at the gold-water interface. WSL is a measure of the bond strength across the solid-liquid interface. Differences in bond strength, and thus differences in WSL, are achieved by varying the terminal group (ω-group) of the alkane-thiol monolayers on the gold. The interface thermal conductance values were in the range 60–190 MW m−2 K−1, and the solid-liquid contact angles span from 25° to 118°.

Analytical model for the effects of wetting on thermal boundary conductance across solid/classical liquid interfaces

“…Ge et al 18 experimentally measured the thermal boundary conductance across Au/water and Al/water interfaces with self-assembled monolayers to vary the degree of hydrophobicity; their measurements show that hydrophilic interfaces have higher thermal boundary conductances than hydrophobic interfaces. Similar measurements across Au/water interfaces were recently reported by Harikrishna et al, 19 and they linked the thermal boundary conductance to the work of adhesion at the interface, directly relating the bonding at the interface to the thermal boundary conductance.…”

“…[6][7][8][9][10][11][12][13][14][15][16][17] However, experimental measurements of the thermal boundary conductance across planar solid and a liquid interfaces (i.e., not nanofluids) at non-cryogenic temperatures are limited. 18,19 Although a wealth of molecular dynamics (MD) simulations have elucidated physical processes at solid/liquid interfaces, a void still exists in terms of analytical modeling of thermal transport across solid/liquid interfaces to parallel that which exists across solid/solid a) M. E. Caplan and A. Giri contributed equally to this work. b) Electronic mail: phopkins@virginia.edu interfaces.…”

Effect of nanostructures on heat transfer coefficient of an evaporating meniscus

“…Here, we use a semi-empirical model to account for the effect of nanostructures on Kapitza resistance. Both experiments and atomic simulations suggest a linear relation between the interfacial thermal conductance (i.e., R À1 K ) and the solid-liquid interaction energy per unit area [31,39,40] that scales linearly with the Wenzel roughness ratio, following R À1 K / r. By fitting the MD results for the Kapitza resistance at a water-gold interface [32] (see Fig. 3), it follows…”

“…Furthermore, existing thin film evaporation models neglected the Kapitza resistance, i.e., the interfacial thermal resistance caused by the mismatch in thermal properties between two contact materials. It is important to note that the Kapitza resistance at a water-gold interface is $10 À8 m 2 K/W [31,32], equivalent to the conduction resistance of a 10 nm water film. As the non-evaporating water film becomes as thin as a few nanometers [25], the Kapitza resistance, which is significantly affected by nanostructures, becomes nontrivial [32,33].…”

Spectral mapping of heat transfer mechanisms at liquid-solid interfaces

“…The transfer of vibrational energy between liquids and solids is, however, poorly understood compared to solid-solid interfaces, in part due to the difficulty of experimentally isolating the thermal resistance of the interface [7,8]. Existing experiments have, however, indicated [8][9][10][11][12] that the interfacial conductance of a typical solid-liquid surface is generally close to the conductance of a typical solid-solid interface.…”