The Influence of Microstructure on Nanomechanical and Diffusion Barrier Properties of Thin PECVD SiOx Films Deposited on Parylene C Substrates

Carpeño, David Framil; Gompel, Matthias Van; Bourgeois, Florian; Furno, I.; Leterrier, Y.

doi:10.3389/fmats.2019.00319

Cited by 9 publications

(5 citation statements)

References 88 publications

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“…The biggest problem with the microstructure defects of the inorganic thin-film capsulation layer is the high porosity at a low temperature. Due to the porous structu the high-porosity films, water vapor can penetrate the nano-scale channels [24][25][26][27] surface and the cross-section of the film were observed through SEM. As shown in F The biggest problem with the microstructure defects of the inorganic thin-film encapsulation layer is the high porosity at a low temperature.…”

Section: Resultsmentioning

confidence: 99%

“…As shown in F The biggest problem with the microstructure defects of the inorganic thin-film encapsulation layer is the high porosity at a low temperature. Due to the porous structure of the high-porosity films, water vapor can penetrate the nano-scale channels [24][25][26][27]. The surface and the cross-section of the film were observed through SEM.…”

Section: Resultsmentioning

confidence: 99%

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Stability of SiNx Prepared by Plasma-Enhanced Chemical Vapor Deposition at Low Temperature

Zhang

Wang

et al. 2021

Nanomaterials

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In this paper, the environmental stability of silicon nitride (SiNx) films deposited at 80 °C by plasma-enhanced chemical vapor deposition was studied systematically. X-ray photoelectron spectroscopy and Fourier transform infrared reflection were used to analyze the element content and atomic bond structure of the amorphous SiNx films. Variation of mechanical and optical properties were also evaluated. It is found that SiNx deposited at low temperature is easily oxidized, especially at elevated temperature and moisture. The hardness and elastic modulus did not change significantly with the increase of oxidation. The changes of the surface morphology, transmittance, and fracture extensibility are negligible. Finally, it is determined that SiNx films deposited at low-temperature with proper processing parameters are suitable for thin-film encapsulation of flexible devices.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Stability of SiNx Prepared by Plasma-Enhanced Chemical Vapor Deposition at Low Temperature

Zhang

Wang

et al. 2021

Nanomaterials

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“…[73,365,366] Hence, (electro-)fragmentation tests associated with residual stress analyses and nanoindentation tests [106] are usually performed to determine the critical strain for failure, the internal stress components, the Young's modulus of the nanosized films, and derive the toughness properties of the film and interfaces. [82,[367][368][369][370][371] (Figure 8D(i)). On the other hand, fatigue tests with cyclic bending/tensile loads applied with properly customized setups are performed to determine the barrier properties in a dynamic mode [106,372,373] (Figure 8D(ii)).…”

Section: Indirect Electromechanical Methodsmentioning

confidence: 99%

Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods

Mariello

Kim

et al. 2022

Advanced Materials

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Bioelectronic implantable systems (BIS) targeting biomedical and clinical research should combine long‐term performance and biointegration in vivo. Here, recent advances in novel encapsulations to protect flexible versions of such systems from the surrounding biological environment are reviewed, focusing on material strategies and synthesis techniques. Considerable effort is put on thin‐film encapsulation (TFE), and specifically organic–inorganic multilayer architectures as a flexible and conformal alternative to conventional rigid cans. TFE is in direct contact with the biological medium and thus must exhibit not only biocompatibility, inertness, and hermeticity but also mechanical robustness, conformability, and compatibility with the manufacturing of microfabricated devices. Quantitative characterization methods of the barrier and mechanical performance of the TFE are reviewed with a particular emphasis on water‐vapor transmission rate through electrical, optical, or electrochemical principles. The integrability and functionalization of TFE into functional bioelectronic interfaces are also discussed. TFE represents a must‐have component for the next‐generation bioelectronic implants with diagnostic or therapeutic functions in human healthcare and precision medicine.

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“…For example, Taylor et al performed large area fabrication of boron doped nano-crystalline diamond films with metallic type conduction using PECVD (figure 7(a)) [30]. Additionally, the PECVD technique has been widely used to fabricate other inorganic thin films like silicon nitride thin films [31], and silicon oxide thin films [32]; organic polymeric thin films like cyclohexene thin films [33], and methylcyclohexane thin films [34]; and even hybrid organicinorganic thin films [35].…”

Section: Vapour-phasementioning

confidence: 99%

Nanoscale self-assembly: concepts, applications and challenges

2022

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Self-assembly offers unique possibilities for fabricating nanostructures, with different morphologies and properties, typically from vapor or liquid phase precursors. Molecular units, nanoparticles, biological molecules and other discrete elements can spontaneously organise or form via interactions at the nanoscale. Currently, nanoscale self-assembly finds applications in a wide variety of areas including carbon nanomaterials and semiconductor nanowires, semiconductor heterojunctions and superlattices, the deposition of quantum dots, drug delivery, such as mRNA-based vaccines, and modern integrated circuits and nanoelectronics, to name a few. Recent advancements in drug delivery, silicon nanoelectronics, lasers and nanotechnology in general, owing to nanoscale self-assembly, coupled with its versatility, simplicity and scalability, have highlighted its importance and potential for fabricating more complex nanostructures with advanced functionalities in the future. This review aims to provide readers with concise information about the basic concepts of nanoscale self-assembly, its applications to date, and future outlook. First, an overview of various self-assembly techniques such as vapour deposition, colloidal growth, molecular self-assembly and directed self-assembly/hybrid approaches are discussed. Applications in diverse fields involving specific examples of nanoscale self-assembly then highlight the state of the art and finally, the future outlook for nanoscale self-assembly and potential for more complex nanomaterial assemblies in the future as technological functionality increases.

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The Influence of Microstructure on Nanomechanical and Diffusion Barrier Properties of Thin PECVD SiOx Films Deposited on Parylene C Substrates

Cited by 9 publications

References 88 publications

Stability of SiNx Prepared by Plasma-Enhanced Chemical Vapor Deposition at Low Temperature

Stability of SiNx Prepared by Plasma-Enhanced Chemical Vapor Deposition at Low Temperature

Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods

Nanoscale self-assembly: concepts, applications and challenges

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