Time-Dependent Fracture 1985
DOI: 10.1007/978-94-009-5085-6_21
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The Influence of Microstructure upon the Creep and Fatigue Crack Growth Behaviour in Inconel 718

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Cited by 6 publications
(10 citation statements)
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“…In the presence of more homogeneous slip, the number of dislocations arriving at a grain boundary would be reduced and, consequently, the stress concentrations and 0 transport to the grain boundaries occurring due to a dislocation "sweep-in" mechanism will also be reduced. Examining thin foils prepared from regions immediately below fracture surfaces by means of transmission electron microscopy Thamburaj et al [42] observed that planar deformation was predominant in the case of existing the finest y " particle size distributions, and the poor resistance of fatigue crack growth in this case is consistent with the mechanism discussed above.…”
Section: Effect Of Grain Size and Grain Boundary Morphologysupporting
confidence: 62%
See 1 more Smart Citation
“…In the presence of more homogeneous slip, the number of dislocations arriving at a grain boundary would be reduced and, consequently, the stress concentrations and 0 transport to the grain boundaries occurring due to a dislocation "sweep-in" mechanism will also be reduced. Examining thin foils prepared from regions immediately below fracture surfaces by means of transmission electron microscopy Thamburaj et al [42] observed that planar deformation was predominant in the case of existing the finest y " particle size distributions, and the poor resistance of fatigue crack growth in this case is consistent with the mechanism discussed above.…”
Section: Effect Of Grain Size and Grain Boundary Morphologysupporting
confidence: 62%
“…Grain boundary morphology is another important microstructural factor that controls the high-temperature crack growth behaviour. Thamburaj et al [42] have pointed out that an irregular grain boundary morphology developed by grain boundary 6 -phase precipitates will enhance creep ductility and resistance to high-temperature fatigue crack growth rate. Andrieu et al [46] observed that the presence of 6 precipitates along the grain boundaries leads to an improvement in creep-crack growth resistance.…”
Section: Effect Of Grain Size and Grain Boundary Morphologymentioning
confidence: 99%
“…Accordingly, this zone will be weak. The second view is that the presence of the S-phase at the grain boundaries is good for the high temperature stress rupture and crack growth properties (9,10,14,18,20,21,24,25,53,54,57). This latter view seems at fust glance to be in conflict with the first view as well as with our observations.…”
Section: Introductioncontrasting
confidence: 53%
“…The compact produced from PSD A given a supersolvus heat treatment shows an average grain size of 10 µm, whilst the compact produced from PSD B gives an average grain size of 21 µm for the same heat treatment. All microstructures from both sub-and supersolvus heat treatments show some GBs that are relatively spherical, implying Zener pinning of the GBs by the PPBs, [3,6]. This is most apparent in the PSD A compact material.…”
Section: Microstructure and Grain Sizementioning
confidence: 99%