The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Zeng, Guang; McDonald, Stuart D.; Gu, Qinfen; Terada, Yasuko; Uesugi, Kentaro; Yasuda, Hideyuki; Nogita, Kazuhiro

doi:10.1016/j.actamat.2014.10.003

Cited by 135 publications

(76 citation statements)

References 71 publications

(139 reference statements)

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“…Within the range of alloys developed, the near eutectic composition of Sn-0.7wt%Cu with Ni trace level elemental additions has found application in wave soldering processes [13,14]. Zeng et al [6] had reported that with concurrent additions of Ni and Zn there is a significant refinement of the microstructure and a more stable interfacial Cu6Sn5 intermetallic is obtained. In addition, Yoon et al [15] had investigated the growth of interfacial Cu6Sn5 in Sn-Cu-Ni solders after thermal ageing and identified that the interfacial intermetallic compound (IMC) activation energy was considered low compared to the activation energy of interfacial IMC in binary Sn-Cu solders.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Salleh

McDonald

Gourlay

et al. 2015

Journal of Elec Materi

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This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu6Sn5 in Sn-0.7 wt.%Cu solder paste soldered on a Cu substrate, using a real-time synchrotron imaging technique. It was found that small additions of Ni significantly alter the formation and growth of the primary Cu6Sn5 intermetallics, making them small. In contrast, without Ni, primary Cu6Sn5 intermetallics tend to continue growth throughout solidification and end up much larger and coarser. The primary effect of the Ni addition appears to be in promoting the nucleation of a larger amount of small Cu6Sn5. The results provide direct evidence of the sequence of events in the reaction of Nicontaining Sn-0.7 wt.%Cu solder paste with a Cu substrate, and in particular the formation and growth of the primary Cu6Sn5 intermetallic 2

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Section: Introductionmentioning

confidence: 99%

“…Due to this disadvantage, many researches has been undertaken on the micro-alloying effects of several elements in the Sn-Cu solder system including Ni [4][5][6][7][8], Zn [6], Bi [9], In [10] and Al [11,12]. These micro-alloying attempts have been made to improve the mechanical properties of a solder joint.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Salleh

McDonald

Gourlay

et al. 2015

Journal of Elec Materi

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“…More reliable hexagonal Cu6Sn5 data was obtained from stabilised hexagonal (Cu,Ni)6(Sn,Zn)5, which has a hP4-Cu6Sn5 structure at all temperatures [28]. The (Cu,Ni)6(Sn,Zn)5 lattice parameters and cell volume data in the temperature range 30~250°C are given in Table 5 and the data are shown in SI- Figure 7.…”

Section: Cu6sn5 Ctementioning

confidence: 99%

“…Note that Cu6Sn5 undergoes a hexagonal  monoclinic transformation at ~186°C and the hexagonal polymorph can be stabilised by doping with elements such as Ni, Zn and Au [27,28].…”

Section: Imc Powder Preparationmentioning

confidence: 99%

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Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn

et al. 2017

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The directional coefficient of thermal expansion (CTE) of intermetallics in electronic interconnections is a key thermophysical property that is required for microstructurelevel modelling of solder joint reliability. Here, CTE ellipsoids are measured for key solder intermetallics using synchrotron x-ray diffraction (XRD). The role of the crystal structure used for refinement on the CTE shape and temperature dependence is investigated. The results are used to discuss the Sn-IMC orientation relationships (ORs) that minimise the in-plane CTE mismatch on IMC growth facets, which are measured with electron backscatter diffraction (EBSD) in solder joints on Cu and Ni substrates. The CTE mismatch in fully-intermetallic joints is discussed, and the relationship between the directional CTE of monoclinic and hexagonal polymorphs of Cu6Sn5 is explored.

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Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

Pal

Bajaj²

2023

Adv Eng Mater

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Void nucleation is a critical issue in wetting because it negatively impacts the solder joint and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect (unbalanced diffusion) and Kirkendall voids (KVs) are developed due to dissimilar diffusivities of species (Cu and Sn) in a diffusion process. However, voids are also nucleated in the supersaturating condition, creating an additional position at or inside the “Kirkendall voids” interface. Various factors (surface modification, reinforcement of fourth elements, substrate type, and impurities) and the environment also support the nucleation of voids. Many researchers have discussed that KVs are nucleated into to intermetallic compounds layers. Reviewing the significant parameters for developing the KV in solid–liquid and solid–solid conditions is essential. Hence, in this review, the potential process of development of the KVs, concepts of thermodynamics, chemical reactions, and growth kinetics are developed. The position and reduction of KVs nucleation are also explained in this paper.

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The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Cited by 135 publications

References 71 publications

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

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