The influence of package thermal resistance on the EMP injection damage effect of transistors

Ren, Xiuyan; Chai, Changchun; Ma, Zhiming; Yang, Yong; Wang, Jing; Ren, Lihua

doi:10.1109/icept.2010.5582767

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging 2010

DOI: 10.1109/icept.2010.5582767

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The influence of package thermal resistance on the EMP injection damage effect of transistors

Xiuyan Ren

Changchun Chai

Zhiming Ma

et al.

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The influence of package thermal resistance on the EMP injection damage effect of transistors

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References 10 publications

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