2003
DOI: 10.1016/s0022-0248(02)02093-6
|View full text |Cite
|
Sign up to set email alerts
|

The influence of point defect on the behavior of oxygen precipitation in CZ-Si wafers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
7
1

Year Published

2013
2013
2024
2024

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 9 publications
(8 citation statements)
references
References 19 publications
0
7
1
Order By: Relevance
“…Oxidation . [24] By this procedure, incorporated interstitial oxygen [O i ] experienced a super-saturated state and nucleated preferentially at efficient sites of increased surface potential such as surface and crystal defects. White contrast ring patterns were revealed in radial direction after this procedure, as shown in Figures 6(a) and (b).…”
Section: B Flow Pattern Defectsmentioning
confidence: 99%
“…Oxidation . [24] By this procedure, incorporated interstitial oxygen [O i ] experienced a super-saturated state and nucleated preferentially at efficient sites of increased surface potential such as surface and crystal defects. White contrast ring patterns were revealed in radial direction after this procedure, as shown in Figures 6(a) and (b).…”
Section: B Flow Pattern Defectsmentioning
confidence: 99%
“…[ 16,17 ] The requirements for nucleation are a sufficient oxygen concentration, the existence of lattice defects, especially vacancies acting as nucleation sites, and a specific thermal history of the material, providing the energy to form the nuclei. [ 16–18 ] The first two conditions are fulfilled along most of the Cz‐Si ingots. Due to the reaction between the silicon melt and the crucible, the crystallized silicon is saturated with interstitial oxygen (O i ).…”
Section: Introductionmentioning
confidence: 99%
“…The investigated 750 mm‐long ingot was pulled with a relatively slow speed of 36 mm h −1 , leading to a cooling rate of about 100 K h −1 at temperatures above 1300 °C. [ 20 ] However, in current Cz‐Si manufacturing (especially for photovoltaics) the pulling rate is much higher (≥60 mm h −1 ), [ 18,21 ] leading to high cooling rates (≫100 K h −1 ) at high temperatures where the temperature–time profile flattens out as room temperature is approached. [ 20,21 ] Nielsen et al [ 5 ] recently even introduced active cooling near the melt/crystal interface in industrial ingot manufacturing to increase throughput.…”
Section: Introductionmentioning
confidence: 99%
See 2 more Smart Citations