The influence of solder composition on the impact strength of lead-free solder ball grid array joints

Tsukamoto, Hideaki; Nishimura, T.; Suenaga, Shoichi; McDonald, Stuart D.; Sweatman, Keith; Nogita, Kazuhiro

doi:10.1016/j.microrel.2010.10.012

Cited by 47 publications

(25 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The The drop impact testing results of the study, where the superior performance of the SAC105 (Sn-1.0Ag-0.5Cu wt.%) alloy over the SAC405 (Sn-4.0Ag-0.5Cu wt.%) alloy can be seen [32] (Color figure available online) addition of Ni to the SC alloy was found to ''smooth'' the morphology of the interfacial Cu 6 Sn 5 layer between the solder BGA and the bonded pad. [33] These results agreed well with research that has been conducted in the area of Ni-doped Cu- 6 Sn 5 by a number of different research groups. [34][35][36][37][38][39][40] The research has documented the strong cross-interaction of Cu and Ni in solder joints.…”

Section: Compositional Modifications To Tin-based Alloyssupporting

confidence: 89%

“…Tsukamoto et al performed a thorough study of Ni-doped and non-Ni-doped Sn-Cu (SC), SAC, and Sn-Pb solder ball grid array (BGA) joint systems via the use of high-speed shear impacting testing. [33] The testing showed that the SC+Ni solder BGAs out-performed all other alloy compositions in shear impact testing. The SAC solder BGAs were found to have the least resistance to shear impact testing, with cracking initiating at the IMC interfacial bond layer and brittle failure of the solder joints.…”

Section: Compositional Modifications To Tin-based Alloysmentioning

confidence: 96%

“…[37][38][39][40] Ni additions were also shown to enhance the planarization of solder IMC (Cu 3 Sn and (Cu, Ni) 6 Sn 5 ) interfacial layers, and the cross-interaction of Cu and Ni has been shown to reduce the thickness of the Cu 3 Sn IMC layer during thermal aging. [33,35] …”

Section: Compositional Modifications To Tin-based Alloysmentioning

confidence: 99%

See 2 more Smart Citations

Advances in Pb-free Solder Microstructure Control and Interconnect Design

Reeve

Holaday

Choquette

et al. 2016

J. Phase Equilib. Diffus.

View full text Add to dashboard Cite

New electronics applications demanding enhanced performance and higher operating temperatures have led to continued research in the field of Pb-free solder designs and interconnect solutions. In this paper, recent advances in the microstructural design of Pb-free solders and interconnect systems were discussed by highlighting two topics: increasing b-Sn nucleation in Snbased solders, and isothermally solidified interconnects using transient liquid phases. Issues in bSn nucleation in Sn-based solders were summarized in the context of Swenson's 2007 review of the topic. Recent advancements in the areas of alloy composition manipulation, nucleating heterogeneities, and rapid solidification were discussed, and a proposal based on a multi-faceted solidification approach involving the promotion of constitutional undercooling and nucleating heterogeneities was outlined for future research. The second half of the paper analyzed two different approaches to liquid phase diffusion bonding as a replacement for high-Pb solders, one based on the application of the pseudo-binary Cu-Ni-Sn ternary system, and the other on a proposed thermodynamic framework for identifying potential ternary alloys for liquid phase diffusion bonding. All of the concepts reviewed relied upon the fundamentals of thermodynamics, kinetics, and solidification, to which Jack Smith substantially contributed during his scientific career.

show abstract

Section: Compositional Modifications To Tin-based Alloyssupporting

confidence: 89%

Section: Compositional Modifications To Tin-based Alloysmentioning

confidence: 96%

See 1 more Smart Citation

Advances in Pb-free Solder Microstructure Control and Interconnect Design

Reeve

Holaday

Choquette

et al. 2016

J. Phase Equilib. Diffus.

View full text Add to dashboard Cite

show abstract

“…It has been further demonstrated that additions of Ni to Sn-0.7Cu solder result in considerable refinement of the Cu6Sn5 primary crystals in the solder bulk, decreasing their size and increasing their number density [17]. Sn-0.7Cu-0.05Ni has been shown to have higher compliance [1] and higher impact strength [18] compared with high-silver Sn-Ag-Cu (SAC) solders which is important in applications that experience drop impacts. However, Sn-0.7Cu-0.05Ni has lower creep strength and fatigue life in thermal cycling than high-silver SAC solders [19][20][21][22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

Belyakov

Xian

Sweatman

et al. 2017

Journal of Alloys and Compounds

Self Cite

View full text Add to dashboard Cite

“…Much of our work has been on Sn-0.7Cu-0.05Ni solder, commonly known as SN100C. Sn-0.7Cu-0.05Ni has been used since 1999 in applications that benefit from its higher 'Ragone fluidity' [24,25], stabilised hexagonal (Cu,Ni)6Sn5 [26], higher compliance [27] and higher impact strength [28] compared with high-silver SAC solders. The 0.05wt%Ni addition is significant with respect to the Sn-Cu-Ni phase diagram [29,30] and produces a slightly hypereutectic composition [31] which leads to reduced Cu substrate dissolution [27,32,33], dopes the Cu6Sn5 with Ni [26,31] and significantly alters the solidification sequence [3] compared with Sn-0.7Cu.…”

Section: Introductionmentioning

confidence: 99%

Nucleation and Growth of Tin in Pb-Free Solder Joints

Gourlay

Belyakov

et al. 2015

JOM

View full text Add to dashboard Cite

The solidification of Pb-free solder joints is overviewed with a focus on the formation of the Sn grain structure and grain orientations. Three solders commonly used in electronics manufacturing, Sn-3Ag-0.5Cu, Sn-3.5Ag and Sn-0.7Cu-0.05Ni, are used as case studies to demonstrate that growth competition between primary dendrites and eutectic fronts during growth in undercooled melts is important in Pb-free solders, and that a metastable eutectic containing NiSn4 forms in Sn-3.5Ag/Ni joints. Additionally, it is shown that the substrate (metallization) has a strong influence on the nucleation and growth of tin. We identify Co, Pd and Pt substrates as having potential to control solidification and microstructure formation. In the case of Pd and Pt substrates, Sn is shown to nucleate on the PtSn4 or PdSn4 IMC reaction layer at relatively low undercooling of ~4K, even for small solder ball diameters down to <200 m. IntroductionThe transition to Pb-free electronic interconnections has been underway for more than a decade and despite the exemptions to the RoHS Directive there are few applications where Pb-free solders are not being used. At the same time, electronic packaging technologies have been advancing and there is an ongoing need to develop next-generation Pb-free solders and substrates that are better suited to smaller joints that can operate at higher temperature and that are more reliable.The most commonly used Pb-free solders are hypoeutectic or near-eutectic compositions from the Sn-Ag-Cu (SAC), Sn-Ag or Sn-Cu-Ni alloy systems. These compositions solidify with significant differences to the near-eutectic Sn-Pb solders used previously. For example, where the Sn-37Pb

show abstract

The influence of solder composition on the impact strength of lead-free solder ball grid array joints

Cited by 47 publications

References 29 publications

Advances in Pb-free Solder Microstructure Control and Interconnect Design

Advances in Pb-free Solder Microstructure Control and Interconnect Design

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

Nucleation and Growth of Tin in Pb-Free Solder Joints

Contact Info

Product

Resources

About