2005
DOI: 10.1088/0953-2048/18/11/015
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The influence of the heating rate on YBCO films prepared by the trifluoroacetate metal–organic deposition process

Abstract: A promising approach used to fabricate YBa2Cu3O7−δ (YBCO) thin films is the metal–organic deposition (MOD) method using trifluoroacetate (TFA) solution. In this method, the heating rate is known to be a crucial parameter and an important variable for optimization. However, there does not seem to be an in-depth understanding of the materials issues associated with different heating rates. Some aspects of this correlation have been addressed in this paper, where the influence of the heating rate during calcinat… Show more

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Cited by 13 publications
(3 citation statements)
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“…In the TFA-MOD process, the calcination takes over 20 h [8], whereas here it takes about 6 h. This is followed by a high-temperature annealing in humid argon/oxygen gas mixture at 800 • C for 1 h in a low oxygen partial pressure (P (O2) = 200 ppm). This 5 h step is similar to that used by the TFA-MOD process, which has been described in detail elsewhere [9].…”
mentioning
confidence: 99%
“…In the TFA-MOD process, the calcination takes over 20 h [8], whereas here it takes about 6 h. This is followed by a high-temperature annealing in humid argon/oxygen gas mixture at 800 • C for 1 h in a low oxygen partial pressure (P (O2) = 200 ppm). This 5 h step is similar to that used by the TFA-MOD process, which has been described in detail elsewhere [9].…”
mentioning
confidence: 99%
“…Detailed analyses at every step of the heating process are explained in earlier publications. 10,11 The comparison of the calcined films (which clearly differentiates the intermediate phases for the two precursors) is shown here. Figure 5 shows the comparative XPS spectra of Y 3d, Ba 3d, and Cu 2p obtained from the samples after calcination using the nanoparticle and the conventional TFA-MOD processes.…”
Section: Xps Investigationmentioning
confidence: 99%
“…However, during the pyrolysis process, the thermal decomposition of TFA precursor films results in a drastic reduction in film thickness and is accompanied by an increase of internal stress in the films. Therefore, the gel films prepared by the standard TFA-based precursor are very susceptible to cracking at decomposition temperatures, especially at temperatures from 200 to 250 • C. In order to avoid cracking in the film, the original temperature-time profile developed for the calcination required nearly 10-20 h [2][3][4][5]. However, this long process time is not compatible with a low-cost manufacturing process.…”
Section: Introductionmentioning
confidence: 99%