2020
DOI: 10.1007/s10854-020-03185-1
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The influence of the pyramidal texture uniformity and process optimization on monocrystalline silicon solar cells

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Cited by 4 publications
(3 citation statements)
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“…When we relied only on optical calculations, the maximum absorption coefficient was observed for 73.12-PTSSC. But, if the surface of SSCs enlarges, the recombination rate also in- 1.5×10 13 1.0×10 19 Doping concentration, cm -3 h w α 06036-3 creases. So, the optical, thermal and electric properties of SSCs are taken into account in the Sentaurus TCAD.…”
Section: Resultsmentioning
confidence: 99%
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“…When we relied only on optical calculations, the maximum absorption coefficient was observed for 73.12-PTSSC. But, if the surface of SSCs enlarges, the recombination rate also in- 1.5×10 13 1.0×10 19 Doping concentration, cm -3 h w α 06036-3 creases. So, the optical, thermal and electric properties of SSCs are taken into account in the Sentaurus TCAD.…”
Section: Resultsmentioning
confidence: 99%
“…So, in this research, a PSSC (planar silicon solar cell), a 54-PTSSC (silicon solar cell covered with a pyramidal texture with an ABP of 54) and a 70.4-PTSSC (silicon solar cell covered with a pyramidal texture with an ABP of 70.4) are chosen as a research object. In this paper, periodic pyramidal textures are formed on the surface of SSCs because when the Zheng Fang chemical feds the silicon surface with alkali NaOH during 456 s, textures of the same size are formed on the surface of silicon [13].…”
Section: Introductionmentioning
confidence: 98%
“…Due to the differences in the structure of the hanging bonds at different crystal faces, the alkali corrosion rate of (100) crystal face is faster than that of (111) crystal face. Such anisotropic alkali corrosion forms positive random "pyramid" structures composed of four (111) faces [5]. From the analysis of the actual working conditions of existed production line, in order to speed up the reaction process and improve the production efficiency and save the cost, the NaOH or KOH solution with a concentration of 1~2 wt% was used as the etchant, coupled with a high reaction temperature of 80~90°C.…”
Section: Introductionmentioning
confidence: 99%