The Influence of Tungsten on the Pitting of Aluminum Films

Shaw, B. A.; Fritz, T. L.; Davis, Glyn; Moshier, W. C.

doi:10.1149/1.2086658

Cited by 52 publications

(37 citation statements)

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“…Figure 4 shows that at pH 13 solution, all Fe, Ni and Cr added alloys (Alloys 2−4), exhibited lower corrosion rates than Alloy 1. This is in accordance with Shaw et al [18], who successfully produced the alloys by sputter deposition and found that these elements increased the pitting potential and passivity of the alloys. As obvious in Figures 5 and 6, when the alloys are immersed for 27 days in pH 1 and pH 13 solutions, the resistivity values of the surfaces showed a general decreasing trend within the first few days of immersion.…”

Section: Gravimetric Analysissupporting

confidence: 92%

Effect of Fe, Ni, and Cr on the corrosion behaviour of hyper-eutectic Al-Si automotive alloy under different pH conditions

Kaiser

Nur

2018

J. Electrochem. Sci. Eng.

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Section: Gravimetric Analysissupporting

confidence: 92%

Effect of Fe, Ni, and Cr on the corrosion behaviour of hyper-eutectic Al-Si automotive alloy under different pH conditions

Kaiser

Nur

2018

J. Electrochem. Sci. Eng.

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“…Among these alloys, Al-W alloys containing approximately 10 at.% are known to exhibit the greatest resistance to pitting corrosion. 1 Since the maximum solubility of W in Al phases is only 0.022 at.% at 640…”

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confidence: 99%

“…• C in the equilibrium state, 2 the formation of Al-W alloy films having high corrosion resistances requires non-equilibrium processes, such as sputtering, 1,[3][4][5][6][7][8] ion implantation, 9 and electrodeposition. [10][11][12] Of these methods, electrodeposition has particular advantages in that a uniform film can be formed relatively quickly and continuously, onto substrates having complex shapes, using simple equipment.…”

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confidence: 99%

Electrodeposition of Al-W Alloy Films in a 1-Ethyl-3-methyl-imidazolium Chloride-AlCl₃Ionic Liquid Containing W₆Cl₁₂

Higashino

Miyake

Fujii

et al. 2017

J. Electrochem. Soc.

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The electrodeposition of Al-W alloy films in a Lewis acidic 1-ethyl-3-methyl-imidazolium chloride (EMIC)-AlCl 3 ionic liquid using W 6 Cl 12 as the W ion source was investigated. W 6 Cl 12 dissolved in the ionic liquid at a higher concentration than other W ion sources used in previous studies. Potentiostatic electrodeposition was performed in a bath containing W 6 Cl 12 at a concentration of 49 mM. Dense Al-W alloy films containing up to 12 at.% W were electrodeposited at potentials more negative than 0 V vs. Al/Al(III). The deposition current density at >0 V was lower than 0.3 mA cm −2 , while that for Al-W alloy films was higher and reached 38 mA cm −2 at −0.5 V. The deposition of W was induced by the deposition of Al. At lower W concentrations, the Al-W alloy films were composed of a super-saturated solid solution, and in the W content range of 9-12 at.% they comprised an amorphous phase. Potentiodynamic polarization and nano-indentation showed that the Al-W alloy films containing 10-12 at.% W exhibited high pitting corrosion resistance, high hardness, and low Young's modulus. Al metal has high oxidation and corrosion resistance, and its chloride-induced pitting corrosion resistance is enhanced by alloying with transition metals. Consequently, Al-transition metal alloys have attracted much research attention as corrosion-protective materials. Among these alloys, Al-W alloys containing approximately 10 at.% are known to exhibit the greatest resistance to pitting corrosion. 1Since the maximum solubility of W in Al phases is only 0.022 at.% at 640• C in the equilibrium state, 2 the formation of Al-W alloy films having high corrosion resistances requires non-equilibrium processes, such as sputtering, 1,3-8 ion implantation, 9 and electrodeposition. 10-12Of these methods, electrodeposition has particular advantages in that a uniform film can be formed relatively quickly and continuously, onto substrates having complex shapes, using simple equipment. Various Al-based alloy films have been electrodeposited in molten salts such as NaCl-AlCl 3 with the addition of ion sources for the alloy component. Recently, electrodeposition using ionic liquids has become more popular owing to their low melting point and low volatility. A representative ionic liquid used for the electrodeposition of Al alloys is Lewis acidic 1-ethyl-3-methylimidazolium chloride (EMIC)-AlCl 3 (where the AlCl 3 /EMIC molar ratio >1 Al-Mn, 18 and Al-Hf 19 are available in the literature. A previous study revealed that electrodeposition in a EMIC-AlCl 3 bath with the addition of W(IV) chloride (WCl 4 ) yielded Al-W alloys, but the W content was lower than 1 at.%.10 Recently, the electrodeposition of Al-W alloy films from an EMIC-AlCl 3 bath with the addition of the W(III) compound K 3 W 2 Cl 9 was reported.11,12 Although the W content of the Al-W alloys reached nearly 96 at.%, the deposits with high W content had powdery morphologies. When the current density was high (>20 mA cm −2 ), dense Al-W alloy films were obtained, but the W content decreased t...

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“…10 atomic percent (a/o), the passive region of the Al-W alloy extends to nearly +2,600 mV against pure aluminum. 20 Even when the W content is only 1.5 a/o, the pitting potential is +500 mV greater than that of pure aluminum. 21 Recently we have succeeded in the electroplating of the binary Al-W alloy from Lewis acidic 66.…”

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confidence: 98%

Electrodeposition of Al-W-Mn Ternary Alloys from the Lewis Acidic Aluminum Chloride−1-Ethyl-3-methylimidazolium Chloride Ionic Liquid

Tsuda

Ikeda

Imanishi

et al. 2015

J. Electrochem. Soc.

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The electrodeposition of non-equilibrium ternary Al-W-Mn alloys was examined in the Lewis acidic 66.7-33.3 m/o aluminum chloride-1-ethyl-3-methylimidazolium chloride (AlCl 3 -[C 2 mim]Cl) ionic liquid (IL). K 3 [W 2 Cl 9 ] and MnCl 2 were added to provide sources of W and Mn. The Al-W-Mn alloys were deposited on Cu wire substrates rotated at a fixed rate of 1000 rpm by using a dc galvanostatic method. The W content in the ternary Al-W-Mn alloys decreased with an increase in the deposition current density and was independent of the K 3 [W 2 Cl 9 ] and MnCl 2 concentrations in the plating solution. However, both the current density and the metal salt concentrations affected the Mn content of the ternary alloys. X-ray diffraction and composition analysis of the resulting Al-W-Mn deposits revealed the presence of an amorphous non-equilibrium alloy phase without chloride contamination. The chloride-induced pitting potential of the Al-W-Mn ternary alloys was found to be superior to that of the related binary alloys, Al-W and Al-Mn, indicating that the presence of two transition metal solutes has a beneficial additive effect on the corrosion resistance of Al. The many useful features and novel physical properties of ionic liquids (ILs), which are also called room-temperature or ambient-temperature molten salts, make them fertile media for future technologies.1-3 Thermodynamically, aluminum metal cannot be electrodeposited from aqueous solutions containing Al(III), because hydrogen is produced before the Al(III) can be reduced. However, Al can be deposited from aprotic, nonaqueous solutions, e.g., organic solvents containing aluminum salts and from chloroaluminate ILs. 4 However, all processes involving the electrodeposition of Al from organic solvents are based on volatile, flammable solvents and pyrophoric aluminum salts, greatly complicating large-scale aluminum plating operations. As a result, one of the fastest emerging technologies based on ILs is the electrodeposition of aluminum and its alloys from chloroaluminate ionic liquids. Although reactive with moisture, these ILs are virtually non-flammable and have negligible vapor pressure. Among the chloroaluminates, AlCl 3 -1-ethyl-3-methylimidazolium chloride (AlCl 3 -[C 2 mim]Cl) IL is under development for industrial-scale aluminum plating and for lab-scale aluminum alloy electrodeposition. mim]Cl IL. The processes leading to these alloys can be divided into underpotential and overpotential deposition. 5 The former alloys are deposited thermodynamically; i.e., their composition as a function of potential can be calculated from the Nernst equation.5 Al-Cu and Al-Ag alloys form by this underpotential mechanism. However, they tend to suffer from significant chloride contamination. The overpotential deposition results in stable non-equilibrium alloy phase with uniform composition and structure. Furthermore, the non-equilibrium alloys exhibit similar chloride-induced pitting potentials as those prepared by physical non-equilibrium alloying methods such as rapid * Elect...

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The Influence of Tungsten on the Pitting of Aluminum Films

Cited by 52 publications

References 1 publication

Effect of Fe, Ni, and Cr on the corrosion behaviour of hyper-eutectic Al-Si automotive alloy under different pH conditions

Effect of Fe, Ni, and Cr on the corrosion behaviour of hyper-eutectic Al-Si automotive alloy under different pH conditions

Electrodeposition of Al-W Alloy Films in a 1-Ethyl-3-methyl-imidazolium Chloride-AlCl₃Ionic Liquid Containing W₆Cl₁₂

Electrodeposition of Al-W-Mn Ternary Alloys from the Lewis Acidic Aluminum Chloride−1-Ethyl-3-methylimidazolium Chloride Ionic Liquid

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The Influence of Tungsten on the Pitting of Aluminum Films

Cited by 52 publications

References 1 publication

Effect of Fe, Ni, and Cr on the corrosion behaviour of hyper-eutectic Al-Si automotive alloy under different pH conditions

Effect of Fe, Ni, and Cr on the corrosion behaviour of hyper-eutectic Al-Si automotive alloy under different pH conditions

Electrodeposition of Al-W Alloy Films in a 1-Ethyl-3-methyl-imidazolium Chloride-AlCl3Ionic Liquid Containing W6Cl12

Electrodeposition of Al-W-Mn Ternary Alloys from the Lewis Acidic Aluminum Chloride−1-Ethyl-3-methylimidazolium Chloride Ionic Liquid

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Electrodeposition of Al-W Alloy Films in a 1-Ethyl-3-methyl-imidazolium Chloride-AlCl₃Ionic Liquid Containing W₆Cl₁₂