Organosilicon slag, generated as a waste product from organosilicon monomer production, had limited options for resource utilization. Previous experiments utilized recovered organosilicon slag to partially replace heating materials in preparing exothermic insulating risers. However, the incorporation of organosilicon slag led to specific issues in the risers including low compressive strength, high resin addition requirement and easy ignition during drying. In order to address these problems, this study analyzed the effects of resol resin parameters and organosilicon slag on the ambient temperature properties of heating insulating risers through single-factor experiments. In addition, adjustment was made to the drying process and an optimal preparation scheme was determined via orthogonal experiments. The purpose of the study was to prepare risers with reduced resin content, increased organosilicon slag addition and adequate compressive strength. Results showed that selecting a resin viscosity of about 170 mPa.s and resin addition of about 13% allowed for relatively good compressive strength and air permeability with less resin required. Additionally, an organosilicon slag addition of 18-21% and particle size under 30 mesh(550 μ m) was beneficial for improving compressive strength. Adjusting the drying process to a two-step heat preservation approach (180°C for 25 min, then 130°C for 35 min) slightly decreased compressive strength compared to the original process; nevertheless, it improved air permeability and prevented the risers from igniting spontaneously during subsequent drying. The optimized preparation scheme determined through orthogonal experiments involved 150 mPa.s resin viscosity, 14% resin addition, 21% organosilicon slag addition and slag particle size less than 30 mesh (550 μm). This yielded a compressive strength of 4.21MPa and air permeability of 75.6, exceeding the standard of the exothermic insulating riser: GB/T13040-2017.