A trilevel resist system was employed to fabricate self-aligned, submicron emitter finger In 0.52 Al 0.48 As/In 0.42 Ga 0.58 As 0.77 Sb 0.23 / In 0.53 Ga 0.47 As double heterojunction bipolar transistors (DHBTs). Selective wet-etchants were used to define the emitter fingers and to form an InGaAs guard-ring around the emitter fingers. Due to the low energy bandgap of the InGaAsSb base layer and type II base-collector junction, a low turn-on voltage of 0.38 V at 1 A/cm 2 and a high dc current gain of 123.8 for a DHBT with a 0.65 × 8.65 µm 2 emitter area were obtained. A unity gain cut-off frequency (f T ) of 260 GHz and a maximum oscillation frequency (f max ) of 485 GHz at J C = 302 kA/cm 2 were achieved.