The Interaction of Creep and Fatigue in Lead-Tin Solders

Tien, J. K.; Hendrix, B. C.; Attarwala, A.I.

doi:10.1007/978-1-4615-3910-0_9

Cited by 7 publications

(2 citation statements)

References 16 publications

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“…This situation is also described as creep-fatigue interaction phenomenon which occurred in the bulk eutectic SnPb alloy. Such a phenomenon was also observed by Kuo et al [2], Tien et al [5] and Tien et al [6]. It was also observed that mechnical cycling at R=0.1 and R=-0.5 at various applied strains and temperature do not contribute to instantaneous stress relaxation to a zero value, as Figure 7 (a) and (b) revealed.…”

Section: Resultssupporting

confidence: 81%

Stress Relaxation and Fatigue Characterisation of Eutectic SnPb Solder Alloy

Hashim¹,

Rahmat

2011

KEM

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Soldering is the most important joining technology in the semiconductor industry, especially for IC chip packaging. The binary eutectic SnPb alloy had been in used for decades, before regulations and restriction on the usage of lead in solders was imposed. Thus, replacing SnPb solder alloy with Pb-free solders has also been an issue in the electronic industry. The previously used SnPb alloy was in used due to several reasons, namely (a) it has low melting temperature (183oC) and solidified at a single temperature to form eutectoid composition, (b) binary in composition and is readily available commercially and (c) many researches had been undertaken in the previous decades. Creep, stress relaxation and fatigue tests were conducted on eutectic SnPb solder alloy in order to study the alloy mechanical characteristics, and hence a suitable Pb-free solder alloy could be chosen as a replacement alloy. In this study, creep, stress relaxation and fatigue tests were conducted on eutectic SnPb solder alloy at 30oC and 50oC, respectively. The study showed that stress relaxation in the alloy decayed instantaneously to zero-value when cycling was done at R=-1 and that cycling was done at 600 cycle per minute (CPM) which enable fatigue test to be conducted on the bulk solder alloy. A non-zero stress relaxation value will result in the alloy to failed predominantly due to creep and fatigue failure will not be observed.

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Section: Resultssupporting

confidence: 81%

Stress Relaxation and Fatigue Characterisation of Eutectic SnPb Solder Alloy

Hashim¹,

Rahmat

2011

KEM

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“…It is well-known that the main failure mechanism of solder joints is thermally-induced fatigue due to thermal expansion mismatch, e.g., [1]. As such, many investigations have been performed to understand and characterize the behavior of solder under high homologous temperatures and cyclic loads, e.g., [2,3], initial microstructure and evolution, which can affect the solder behavior significantly, e.g., [4,5], and prediction of fatigue life, e.g., [6].…”

Section: Introductionmentioning

confidence: 99%

Characteristics of solder joints under fatigue loads using piezomechanical actuation

Shim

Spearing

2003

SPIE Proceedings

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Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezoceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

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