The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils

Yin, Kuibo; Xia, Yidong; Chan, Chia‐Hsin; Zhang, W.Q.; Wang, Q.J.; Zhao, Xiaoning; Li, A.D.; Liu, Z.G.; Bayes, Martin; Yee, K. W.

doi:10.1016/j.scriptamat.2007.08.028

Cited by 41 publications

(32 citation statements)

References 24 publications

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“…This was consistent with other authors' findings that bonding is more likely toward the particle peripheries, where adiabatic shearing is active, and disruption of the protective oxide films may take place. [16] Overall, the linear fraction of the interface that had become separated was~26 pct, lower than our other studies of cold spray bonding, which was attributed to the strong jetting behavior in both the particle and substrate. [17] Figures 5 and 6 also yielded useful information about the distribution of plastic strain and resulting microstructural evolution.…”

Section: Resultscontrasting

confidence: 69%

Microstructural Refinement within a Cold-Sprayed Copper Particle

King

Zahiri

Jahedi

2009

Metall Mater Trans A

126

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Section: Resultscontrasting

confidence: 69%

Microstructural Refinement within a Cold-Sprayed Copper Particle

King

Zahiri

Jahedi

2009

Metall Mater Trans A

126

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“…A wide exothermic peak was found at around 210℃. The activation energy can be obtained from Kissinger equation, which depicts the relationship between heating rate and peak temperature [15]:…”

Section: Resultsmentioning

confidence: 99%

Thermodynamic and Kinetic Analysis of Lowtemperature Thermal Reduction of Graphene Oxide

Yin

Xia

et al. 2011

Nano-Micro Lett.

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Abstract:The thermodynamic state and kinetic process of low-temperature deoxygenation reaction of graphene oxide (GO) have been investigated for better understanding on the reduction mechanism by using Differential Scanning Calorimetry (DSC), Thermogravimetry-Mass Spectrometry (TG-MS), and X-ray Photoelectron Spectroscopy (XPS). It is found that the thermal reduction reaction of GO is exothermic with degassing of CO2, CO and H2O. Graphene is thermodynamically more stable than GO. The deoxygenation reaction of GO is kinetically controlled and the activation energy for GO is calculated to be 167 kJ/mol (1.73 eV/atom).

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“…34,35 Extended solid solubility. The mechanisms for extended solid solubility include the following: (I) the driving force due to the stored energy in grain boundaries, 36 (II) the negative heat of mixing of multicomponent systems due to high oxygen content in the milling process, 37 (III) the fragments with small tip radii are formed during milling-induced deformation such that the capillary pressure forces the atoms at the tips of fragments to dissolve, 38 (IV) the high dislocation density regions act as diffusion paths, 39 and/or (V) the energetic contribution of the phase interfaces enhance the free energy of the composite above that of the solid solution, thus providing the driving force for alloying. 40 Disadvantage: The Need for Thermal Stability…”

Section: Advantages: Grain Refinement Mechanismmentioning

confidence: 99%

“…Under heat treatment to only $10% of the melting temperature, the grain size of nc Cu doubles. 45 Several studies have reported both strain relaxation and grain growth for pure, nanocrystalline copper between 100°C and 225°C [32][33][34][35][36][37][38][39]45 ($10-20% T m ). Thus, maturing the technology to enable thermal stability in nanocrystalline materials must be realized if steps are to be made toward largescale applications.…”

Section: Advantages: Grain Refinement Mechanismmentioning

confidence: 99%

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

Tschopp

Murdoch

Kecskes

et al. 2014

JOM

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It is a new beginning for innovative fundamental and applied science in nanocrystalline materials. Many of the processing and consolidation challenges that have haunted nanocrystalline materials are now more fully understood, opening the doors for bulk nanocrystalline materials and parts to be produced. While challenges remain, recent advances in experimental, computational, and theoretical capability have allowed for bulk specimens that have heretofore been pursued only on a limited basis. This article discusses the methodology for synthesis and consolidation of bulk nanocrystalline materials using mechanical alloying, the alloy development and synthesis process for stabilizing these materials at elevated temperatures, and the physical and mechanical properties of nanocrystalline materials with a focus throughout on nanocrystalline copper and a nanocrystalline Cu-Ta system, consolidated via equal channel angular extrusion, with properties rivaling that of nanocrystalline pure Ta. Moreover, modeling and simulation approaches as well as experimental results for grain growth, grain boundary processes, and deformation mechanisms in nanocrystalline copper are briefly reviewed and discussed. Integrating experiments and computational materials science for synthesizing bulk nanocrystalline materials can bring about the next generation of ultrahigh strength materials for defense and energy applications.

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The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils

Cited by 41 publications

References 24 publications

Microstructural Refinement within a Cold-Sprayed Copper Particle

Microstructural Refinement within a Cold-Sprayed Copper Particle

Thermodynamic and Kinetic Analysis of Lowtemperature Thermal Reduction of Graphene Oxide

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

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