The kinetics of failure of copper in the presence of liquid bismuth with a chemically active addition of Sb

Glikman, E. É.; Goryunov, Yu. V.; Ledovskaya, I. Yu.

doi:10.1007/bf00729233

Cited by 5 publications

(3 citation statements)

References 1 publication

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“…This process can deactivate kinks as the sites of preferential dissolution and condensation at the liquid/solid interface and therefore reduce Cj and thus the crack rate, even in the very dilute liquid solutions. It is likely that just this effect was observed in the study [41] of the reaction crack kinetics in polycrystalline Cu in contact with Bi X Pb 1-X liquids alloyed additionally with only 0.15 pct Sb. The additive of Sb, which forms several intermetallic compounds with Cu, made the crack extension discontinuous and reduced the average cracking rate considerably.…”

Section: G On the Role Of Alloying Elements And Impurities In Lmsmentioning

confidence: 89%

Dissolution Condensation Mechanism of Stress Corrosion Cracking in Liquid Metals: Driving Force and Crack Kinetics

Glickman

2010

Metall Mater Trans A

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Stress corrosion cracking (SCC) in aqueous solution is driven by exothermic reactions of metal oxidation. This stimulus, as well as classical mechanisms of SCC, does not apply to SCC in liquid metals (LMs). In the framework of the dissolution-condensation mechanism (DCM), we analyzed the driving force and crack kinetics for this nonelectrochemical mode of SCC that is loosely called ''liquid metal embrittlement'' (LME). According to DCM, a stress-induced increase in chemical potential at the crack tip acts as the driving force for out-of-the-tip diffusion mass transfer that is fast because diffusion in LMs is very fast and surface energy at the solid-liquid interface is small. In this article, we review two versions of DCM mechanism, discuss the major physics behind them, and develop DCM further. The refined mechanism is applied then to the experimental data on crack velocity V vs stress intensity factor, the activation energy of LME, and alloying effects. It is concluded that DCM provides a good conceptual framework for analysis of a unified kinetic mechanism of LME and may also contribute to SCC in aqueous solutions. CRYSTAL plasticity and strength are environmentally sensitive properties. Along with corrosion and stress corrosion cracking (SCC), complex but well amenable to scientific interpretation electrochemical phenomena, more abstruse nonelectrochemical effects in crystal plasticity were observed for solids of different molecular nature when under simultaneous action of tensile stress and wetting liquids. The most famous among these effects is liquid metal embrittlement (LME), which describes premature failure of metals under simultaneous action of tensile stress and wetting liquid metals. LME creates potential reliability concerns in many technologies, including nuclear energy, welding, soldering, protective coatings, and gas industry. [1][2][3][4][5][6][7][8][9][10] The fact that LME was reported not only for polycrystals but also for single-crystalline [1][2][3][4][5] and amorphous metals [11] suggests that the phenomenon can not be explained in terms of either grain boundary (GB) diffusion/grooving modified by stress or adsorptionenhanced dislocation injection/mobility. LME was reported to most strongly manifest itself in solid metal (SM)-liquid metal (LM) couples, which form simple eutectic phase diagrams without any intermetallics; [9] this suggests that the concept of formation and fracture of brittle surface films does not apply to LME. Figure 1 taken from Reference 5 shows that LME involves subcritical crack growth, the typical feature that distinguishes SCC from crack nucleation-controlled brittle fracture below the ductile-brittle transition temperature in inert atmosphere. Crack kinetics observations have made clear that LME is not a ductile-brittle transition but a special case of time-dependent process of SCC. The subcritical growth under LME starts at an apparent threshold stress intensity K TH that can be as small as~0.1 MPaAEm ½ ; the process of crack extension spans almost all the lifetim...

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Section: G On the Role Of Alloying Elements And Impurities In Lmsmentioning

confidence: 89%

Dissolution Condensation Mechanism of Stress Corrosion Cracking in Liquid Metals: Driving Force and Crack Kinetics

Glickman

2010

Metall Mater Trans A

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“…A liquid metal which contacted a solid metal can penetrate very fast into the grain boundaries of the solid metal very fast due to external stresses or without them. Whereas the liquid metal penetration (LMP) under applied stresses is well known and there are a quite good models [1][2][3][4][5][6][7], the pairs of metals like Al-Ga, Cu-Bi, Ni-Bi are more interesting because in this case LMP occurs without external stresses.…”

Section: Introductionmentioning

confidence: 99%

The Liquid Bismuth Penetration from Solid Bi2Te3: Grain Boundary Embrittlement and Effect of Impurities

Zhevnenko

Vaganov

Gershman

2011

DDF

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The liquid bismuth penetration from solid bismuth telluride (Bi2Te3) into grain boundaries of copper and copper-based solid solutions was studied. The experiments were performed at 570 oC in hydrogen atmosphere. The copper specimens were annealed from 10 to 90 minutes. Solid Bi2Te3 didn’t contact with copper specimens during experiments, so copper was covered by the decay products of Bi2Te3 through the gas phase. Liquid Bi penetration leads to grain boundary embrittlement of copper. We assumed that the depth of penetration is equal to the length of cracks which are formed after sample bending. It was shown that there is only bismuth at the grain boundaries while on the surface tellurium also exists. Bismuth concentration in the grain boundaries measured by Auger spectroscopy was about 10-20 at. % and the width of penetration channel was less then 10 nm. Bismuth covered the grain boundaries uniformly. Time dependence of the penetration depth was approximately parabolic. In the present work the effect of impurities (silver, iron) on grain boundary liquid bismuth penetration was studied also. It was shown that silver accelerates the penetration in contrast to iron. The probable reasons were discussed.

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“…It is well known that intergranular penetration of liquid bismuth in copper has a high rate [1][2]. The rate of penetration usually is about 20 μm/min in the temperature range 500-600 o C. However, the penetration mechanism is not clear.…”

Section: Introductionmentioning

confidence: 99%

Embrittlement of Cu and Cu-Based Alloys by Bi and Bi2Te3

Zhevnenko

Vaganov

Gershman

2010

DDF

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Degradation of the mechanical properties of copper and copper based alloys after the treatment with telluride bismuth (Bi2Te3) at 570oC has been studied in the present work. The experiments were performed in a H2 deoxidizing atmosphere. The kinetics of embrittlement of pure copper has been shown to be parabolic. Bi2Te3 was in the solid state and was not in direct contact with the copper specimens during the experiments, i.e. the plating was performed through the gas phase. The brittle fracture along the GB was observed after 3 point bending test. The surface of fracture was investigated with the use AES. It was shown that intergranular penetrations of liquid bismuth and bismuth from Bi2Te3 have different mechanisms.

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The kinetics of failure of copper in the presence of liquid bismuth with a chemically active addition of Sb

Cited by 5 publications

References 1 publication

Dissolution Condensation Mechanism of Stress Corrosion Cracking in Liquid Metals: Driving Force and Crack Kinetics

Dissolution Condensation Mechanism of Stress Corrosion Cracking in Liquid Metals: Driving Force and Crack Kinetics

The Liquid Bismuth Penetration from Solid Bi<sub>2</sub>Te<sub>3</sub>: Grain Boundary Embrittlement and Effect of Impurities

Embrittlement of Cu and Cu-Based Alloys by Bi and Bi<sub>2</sub>Te<sub>3</sub>

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